Temperature Sensors—Fundamentals, Detectors, Arrays and Applications, Volume II

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (30 November 2021) | Viewed by 3275

Special Issue Editor


E-Mail Website
Guest Editor
Department of Physics, New Jersey Institute of Technology, 323 Dr Martin Luther King Jr Blvd, Newark, NJ 07102, USA
Interests: materials science & engineering; semiconductors; energy; solar cells; 3D printing; biomaterials; drug delivery systems; transdermal patches
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Temperature measurement and control continues to be of enormous interest to material/device/circuit designers, engineers and scientists.  As circuit components get smaller and the device density per unit area gets larger, thermal management, at the materials/device/circuit/system level, has become a critical issue.  Temperature measurements, by contact methods such as thermocouples and non-contact methods such as pyrometers, are necessary due to the complex kinetics of processes as well as the short process times and large wafer sizes.  There is a constant demand on the accuracy, repeatibility and reproducibility of the spatial/temporal measurement of temperature.

Temperature measurement, via conventional thermometry or by non-contact methods such as pyrometry or reflectometry, also plays an important role in monitoring a variety of industrial processes.  These include, for example, temperature of rechargeable batteries during charging/discharging, water temperature in an engine, temperature in furnaces or the exhaust gases from a rocket, monitoring the temperature of a transformer or a generator or a windmill etc.

This special issue of Micromachines invites designers, engineers, scientists to contribute manuscripts that address temperature mapping, measurement and control, including the following topics:

  • Contact Thermometry – Thermometers, Thermocouples, Thermopiles, Semiconductors, Thermistors, Thermopiles, Resistance Temperature Detectors
  • Non-Contact Thermometry – Spectral Emissometry, Pyroelectrics, Pyrometers, Time Resolved Reflectivity, Infrared Detectors, Infrared Imaging Arrays, Microbolometers, Acoustic Thermometery, Raman Thermometry, Schottky Barriers, Quantum Dots, Strained Superlattices, Superconductors
  • Materials – Vanadium Oxides, Lead Tin Chalcogenides, Mercury Cadmium Telluride, Amorphous Silicon, Black Silicon, Graphene, Two Dimensional Materials, Carbon Nanotubes, Ge, InGaAs, InSb, InAsSb, Polymers, Composites, Superconductors
  • Components – Microlenses, IR Filters, ROICs, Gratings, Diodes, Schottky Barriers
  • Fundamentals – Emissivity measurements and modeling, Development of Standards for Temperature Measurements & Mapping, Development of New Thermocouples
  • Applications – Low and High Temperature Applications, Process Monitoring, Monitoring Furnaces/Transformers/Batteries/Circuits/Turbines/Engines/Windmills, Failure Analysis, Space/Astronomy, Biological Systems

Prof. Dr. Nuggehalli M. Ravindra
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Spectral Emissometers
  • Thermocouples
  • Nano/Microbolometers
  • Infrared Detectors
  • Pyrometers
  • Pyroelectrics
  • Acoustic Thermometry
  • Raman Thermometry
  • Infrared Cameras/Focal Plane Arrays Process Monitoring
  • Quantum Well/Multiquantum Well
  • Graphene
  • Two Dimensional Materials
  • Carbon Nanotubes
  • HgCdTe
  • PbSnTe
  • Polymers
  • Polymer Composites
  • Polymer Optical Fibers
  • Shape Memory
  • Fiber Gratings
  • Vanadium Oxides
  • InSb
  • InAsSb
  • InGaAs
  • Ge
  • Infrared Filters
  • Infrared Lenses
  • Schottky Barriers
  • Superlattices
  • Quantum Dots
  • Superconductors

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Review

16 pages, 4909 KiB  
Review
Thermochromic Polymeric Films for Applications in Active Intelligent Packaging—An Overview
by Airefetalo Sadoh, Samiha Hossain and Nuggehalli M. Ravindra
Micromachines 2021, 12(10), 1193; https://doi.org/10.3390/mi12101193 - 30 Sep 2021
Cited by 9 | Viewed by 2820
Abstract
The need for passive sensors to monitor changes in temperature has been critical in several packaging related applications. Most of these applications involve the use of bar codes, inks and equipment that involve constant complex electronic manipulation. The objective of this paper is [...] Read more.
The need for passive sensors to monitor changes in temperature has been critical in several packaging related applications. Most of these applications involve the use of bar codes, inks and equipment that involve constant complex electronic manipulation. The objective of this paper is to explore solutions to temperature measurements that not only provide product information but also the condition of the product in real time, specifically shelf-life. The study will explore previously proposed solutions as well as plans for modified approaches that involve the use of smart polymers as temperature sensors. Full article
Show Figures

Figure 1

Back to TopTop