Novel Materials, Device Designs, and Fabrication Strategies for Bioelectronic Devices and Sensors

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "B:Biology and Biomedicine".

Deadline for manuscript submissions: closed (31 October 2022) | Viewed by 77

Special Issue Editor


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Guest Editor
Department of Aerospace Engineering and Engineering Mechanics, Cockrell School of Engineering, University of Texas at Austin, Austin, TX 78712, USA
Interests: electronics; bioelectronic devices; wearable electronics; sensors and actuators; advanced materials; energy harvesting
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Special Issue Information

Bioelectronic devices are emerging as a highly interdisciplinary and disruptive technology, attracting great attention from researchers all over the world including mechanical engineers, electrical engineers, bioengineers, material scientists, and even clinicians due to their wide range of applications, such as implantable electrophysiological sensors, wearable healthcare monitoring devices, brain–computer interfaces, therapeutic devices, and drug delivery systems. Different flexible/stretchable and biocompatible materials, cutting-edge device designs, and manufacturing methodologies have been developed to advance the functionalities and performance of those bioelectronic devices and sensors. These wearable bioelectronic devices include several components such as a sensor unit, processing unit, communication unit, and power supply unit. Increasing the integration of these devices to the human skin/body with more flexibility, stretchability, conformability, facile fabrication, and adaptive design could lead to long-term monitoring and diagnosis of health conditions using next-generation personal healthcare monitoring devices. This Special Issue welcomes all papers (original research papers and reviews) that deal with bioelectronic devices, including but not limited to physiological, biosensors, and chemical sensors corresponding to 2D materials, conductive polymers, nanomaterials, 3D printing, robotics, prosthetics, e-tattoos, and e-skin.

Dr. Pukar Maharjan
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

• flexible electronics
• stretchable electronics
• bioelectronic devices
• integrated electronics
• wearable electronics
• wearable sensors
• biosensors
• physiological sensors
• chemical sensors
• 2D materials
• nanomaterials
• E-tattoo
• E-skin
• skin electronics
• self-powered sensors
• biomedical devices
• soft materials

Published Papers

There is no accepted submissions to this special issue at this moment.
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