Advances in Micro and Nano Manufacturing: Process Modeling and Applications, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: closed (31 March 2024) | Viewed by 745

Special Issue Editors

Department of Engineering and Design, Western Washington University, Bellingham, WA 98225, USA
Interests: biopolymers; ocean plastics; upcycling & recycling of plastic products; advanced and intelligent polymer processes; sustainable manufacturing
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Special Issue Information

Dear Colleagues,

It is our pleasure to warmly invite you to participate in the upcoming 3rd volume of our Special Issue, entitled ‘Advances in Micro and Nano Manufacturing: Process Modeling and Applications’, dedicated to micro and nano manufacturing processes. Building upon the resounding success of the previous volumes [https://www.mdpi.com/journal/micromachines/special_issues/Micro_Manufacturing; https://www.mdpi.com/journal/micromachines/special_issues/Micro_Manufacturing_II], this edition aims to continue fostering innovation and knowledge dissemination in this dynamic field.

Micro and nano manufacturing technologies have witnessed remarkable progress in research and industrial environments, enabling product miniaturization and the integration of new functionalities. In comparison to conventional manufacturing scales, micro- and nano-scale technologies pose unique challenges, necessitating the study and modeling of diverse mechanical, thermal, and fluid dynamics phenomena.

The 3rd volume of this Special Issue seeks to advance the frontiers in micro and nano manufacturing processes across a broad spectrum of techniques, including micro/nano injection molding, powder injection molding, micro milling, micro EDM, micro waterjet cutting, additive manufacturing, and beyond. We cordially invite contributions in, but not limited to the following areas:

Innovative Modeling Approaches: Share your groundbreaking research on the development of novel modeling techniques tailored to micro and nano manufacturing processes.

Validation and Rigorous Testing: Ensure the reliability and accuracy of models by validating them against experimental data, contributing to the robustness of the field.

Material Model Calibration: Present methodologies for effectively calibrating material models, addressing the specific challenges posed by micro and nano manufacturing scales.

Theoretical vs. Experimental Analyses: Explore theoretical predictions and compare them with experimental observations, shedding light on the strengths and limitations of current models.

Process Optimization Insights: Investigate the influence of various processing factors on selected process response variables, offering valuable insights for optimizing micro and nano manufacturing processes.

As with previous volumes, this Special Issue maintains its inclusivity, welcoming contributions across a wide spectrum of materials and manufacturing methods. By doing so, we aim to provide a comprehensive compilation of the latest advancements, exemplifying the pivotal role of modeling and simulation in advancing micro and nano manufacturing technologies.

Your participation in this endeavor is crucial to the continued growth and development of this field. We encourage you to submit your research, share your insights, and engage in the dialogue that will drive innovation forward.

We look forward to your valuable contributions to the 3rd volume of this Special Issue, and we are confident that, together, we will further the frontiers of micro and nano manufacturing.

Dr. Davide Masato
Dr. Peng Gao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro manufacturing
  • modeling
  • simulation
  • materials
  • processing

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Published Papers (2 papers)

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Research

15 pages, 1565 KiB  
Article
Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length
by Bowen Ren, Lan Chen, Rong Chen, Yan Sun and Yali Wang
Micromachines 2024, 15(4), 549; https://doi.org/10.3390/mi15040549 (registering DOI) - 19 Apr 2024
Viewed by 191
Abstract
As a planarization technique, chemical mechanical polishing (CMP) continues to suffer from pattern effects that result in large variations in material thickness, which can influence circuit performance and yield. Therefore, tools for predicting post-CMP chip morphology based on the layout-dependent effect (LDE) have [...] Read more.
As a planarization technique, chemical mechanical polishing (CMP) continues to suffer from pattern effects that result in large variations in material thickness, which can influence circuit performance and yield. Therefore, tools for predicting post-CMP chip morphology based on the layout-dependent effect (LDE) have become increasingly critical and widely utilized for design verification and manufacturing development. In order to characterize the impact of patterns on polishing, such models often require the extraction of graphic parameters. However, existing extraction algorithms provide a limited description of the interaction effect between layout patterns. To address this problem, we calculate the average density as a density correction and innovatively use a one-dimensional line contact deformation profile as a weighting function. To verify our hypothesis, the density correction method is applied to a density step-height-based high-K metal gate-CMP prediction model. The surface prediction results before and after optimization are compared with the silicon data. The results show a reduction in mean squared error (MSE) of 40.1% and 35.2% in oxide and Al height predictions, respectively, compared with the preoptimization results, confirming that the optimization method can improve the prediction accuracy of the model. Full article
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13 pages, 6979 KiB  
Article
Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation
by Seonho Seok, HyungDal Park and Jinseok Kim
Micromachines 2024, 15(4), 543; https://doi.org/10.3390/mi15040543 - 18 Apr 2024
Viewed by 340
Abstract
This paper presents a direct 3D numerical simulation of biaxial surface wrinkling of thin metal film on a compliant substrate. The selected compliant substrate is a commercial Scotch tape on which a gold metal thin film has been transferred by using low adhesion [...] Read more.
This paper presents a direct 3D numerical simulation of biaxial surface wrinkling of thin metal film on a compliant substrate. The selected compliant substrate is a commercial Scotch tape on which a gold metal thin film has been transferred by using low adhesion between the thin metal film and polyimide substrate. Compared with the previous fabrication of a cylindrical thin-film wrinkling pattern, an undulated wrinkling pattern has been implemented by increasing the width of the thin metal film in order to create biaxial straining in the thin film. To understand the wrinkling behavior due to biaxial loading, a simple direct numerical simulation based on material imperfections defined in the compliant substrate has been conducted. Through modeling and simulation, it was found that the wrinkling mode is determined by the biaxiality ratio (BR), the ratio between transversal strain and longitudinal strain. Depending on the BR, the wrinkling mode belongs to one of the cylindrical, undulated (or herringbone), checkerboard, or labyrinth modes as a function of applied strain. The cylindrical wrinkling is dominant at the input of BR less than 0.5, while the undulated (or herringbone) ones become dominant just after the onset of the wrinkling pattern at BR greater than 0.9. Through the comparison of the wrinkling patterns between simulation and experiment, the applied BR of the fabricated thin film has been successfully estimated. Full article
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