Basic MEMS Actuators

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 30 June 2024 | Viewed by 1168

Special Issue Editor


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Guest Editor
School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou 510006, China
Interests: MEMS; metamaterials; nanophotonics; microfluidics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

With the rapid development of MEMS technology, it could be classified into many fields, such as CMOS MEMS, RF MEMS, optical MEMS, bio-MEMS, and so on. Current nano- and microtechnology provides an effective approach to specifically perform actuation and sensing functions using passive or active manipulations enabling novel breakthrough applications.

This Special Issue on “Basic MEMS Actuators” brings together multidisciplinary interest in one journal entirely devoted to disseminating information on all aspects of research and development of MEMS devices for transducing physical signals. The aim is to publish research on actuators, structures, integrated sensors–actuators, microsystems, and other devices or subdevices ranging in size from millimeters to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems such as power supplies and signal transmission; microsystem-related simulation tools; and other topics of interest to micromechanics. This Special Issue on “Basic MEMS Actuators” will publish original papers and invited review articles. The major areas of activity in the development of novel actuators, sensors, and transducers solicited and expected in this Special Issue are within the following device areas:

  • Actuators and microsystems;
  • Packaging and solid-state materials and fabrication processes;
  • Nanoscale materials and fabrication;
  • Composite materials, polymers, and fabrication processes;
  • Microfluidic platform technologies;
  • Energy, power, and thermal management;
  • Chemical sensors and microsystems;
  • Biosensors and microsystems including in vitro medical applications;
  • Wearable and in vivo medical devices and microsystems;
  • Physical sensors and microsystems;
  • Rf mems, resonators, and oscillators;
  • Optical and atomic transducers.

Experimental results, as well as design, simulation, and theory on each topic are of interest.

Dr. Yu-Sheng Lin
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS
  • actuator
  • sensors
  • microstructures
  • nanomaterials
  • nanophotonics
  • metamaterials
  • photonic integrated circuit
  • microfluidics
  • biochips
  • 3D printing

Published Papers (1 paper)

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Research

11 pages, 4562 KiB  
Article
Lithium Niobate MEMS Antisymmetric Lamb Wave Resonators with Support Structures
by Yi Zhang, Yang Jiang, Chuying Tang, Chenkai Deng, Fangzhou Du, Jiaqi He, Qiaoyu Hu, Qing Wang, Hongyu Yu and Zhongrui Wang
Micromachines 2024, 15(2), 195; https://doi.org/10.3390/mi15020195 - 27 Jan 2024
Viewed by 857
Abstract
The piezoelectric thin film composed of single-crystal lithium niobate (LiNbO3) exhibits a remarkably high electromechanical coupling coefficient and minimal intrinsic losses, making it an optimal material for fabricating bulk acoustic wave resonators. However, contemporary first-order antisymmetric (A1) Lamb mode resonators based [...] Read more.
The piezoelectric thin film composed of single-crystal lithium niobate (LiNbO3) exhibits a remarkably high electromechanical coupling coefficient and minimal intrinsic losses, making it an optimal material for fabricating bulk acoustic wave resonators. However, contemporary first-order antisymmetric (A1) Lamb mode resonators based on LiNbO3 thin films face specific challenges, such as inadequate mechanical stability, limited power capacity, and the presence of multiple spurious modes, which restrict their applicability in a broader context. In this paper, we present an innovative design for A1 Lamb mode resonators that incorporates a support-pillar structure. Integration of support pillars enables the dissipation of spurious wave energy to the substrate, effectively mitigating unwanted spurious modes. Additionally, this novel approach involves anchoring the piezoelectric thin film to a supportive framework, consequently enhancing mechanical stability while simultaneously improving the heat dissipation capabilities of the core. Full article
(This article belongs to the Special Issue Basic MEMS Actuators)
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