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Micromachines
Special Issues
Flexible and Wearable Sensors, 3rd Edition
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Flexible and Wearable Sensors, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 1820

Special Issue Editors

Dr. Libo Gao

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Guest Editor
Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China
Interests: flexible sensor; flexible and wearable electronics; 3D printing
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Zhuoqing Yang

E-Mail Website
Guest Editor
National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Interests: flexible electronics; MEMS; flexible sensor
Special Issues, Collections and Topics in MDPI journals
Dr. Gaofeng Zheng

E-Mail Website
Guest Editor
Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen 361102, China
Interests: electrostatic spinning-based flexible microsystems integration; flexible electronics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Due to their favorable flexibility and adaptability, flexible and wearable electronics have exhibited enormous potential in broad prospects on human–machine interaction, robotics, and healthcare monitoring. Consequently, they have become one of the most attractive and rapidly growing areas of novel interdisciplinary research. As the core components of flexible electronics, the excellent flexibility sensing performance of flexible and wearable sensors are important guarantees for flexible wearable electronics, which have become the focus of domestic and international research. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on:

(1) Novel structural designs, material fabrication, signal processing, and modeling of flexible and wearable sensors based on all kinds of mechanisms;

(2) MEMS technique process of wearable and flexible sensors and simulation process of theoretical modeling;

(3) Multiple application scenarios in multivariable flexible and wearable sensor systems. 

Dr. Libo Gao
Prof. Dr. Zhuoqing Yang
Dr. Gaofeng Zheng
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible sensors
  • electronic skin
  • flexible electronics
  • wearable electronics
  • MEMS wearable applications

Related Special Issues

Published Papers (2 papers)

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Research

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13 pages, 14158 KiB  
Article
Flexible Symmetric-Defection Antenna with Bending and Thermal Insensitivity for Miniaturized UAV
by Xueli Nan, Tongtong Kang, Zhonghe Zhang, Xin Wang, Jiale Zhang, Yusheng Lei, Libo Gao, Jianli Cui and Hongcheng Xu
Micromachines 2024, 15(1), 159; https://doi.org/10.3390/mi15010159 - 21 Jan 2024
Viewed by 878
Abstract
Flexible conformal-enabled antennas have great potential for various developable surface-built unmanned aerial vehicles (UAVs) due to their superior mechanical compliance as well as maintaining excellent electromagnetic features. However, it remains a challenge that the antenna holds bending and thermal insensitivity to negligibly shift [...] Read more.
Flexible conformal-enabled antennas have great potential for various developable surface-built unmanned aerial vehicles (UAVs) due to their superior mechanical compliance as well as maintaining excellent electromagnetic features. However, it remains a challenge that the antenna holds bending and thermal insensitivity to negligibly shift resonant frequency during conformal attachment and aerial flight, respectively. Here, we report a flexible symmetric-defection antenna (FSDA) with bending and thermal insensitivity. By engraving a symmetric defection on the reflective ground, the radiated unit attached to the soft polydimethylsiloxane (PDMS) makes the antenna resonate at the ISM microwave band (resonant frequency = 2.44 GHz) and conformal with a miniaturized UAV. The antenna is also insensitive to both the bending-conformal attachment (20 mm < r < 70 mm) and thermal radiation (20~100 °C) due to the symmetric peripheral-current field along the defection and the low-change thermal effect of the PDMS, respectively. Therefore, the antenna in a non-bending state almost keeps the same impedance matching and radiation when it is attached to a cylinder-back of a UAV. The flexible antenna with bending and thermal insensitivity will pave the way for more conformal or wrapping applications. Full article
(This article belongs to the Special Issue Flexible and Wearable Sensors, 3rd Edition)
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Review

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18 pages, 4848 KiB  
Review
Review of Droplet Printing Technologies for Flexible Electronic Devices: Materials, Control, and Applications
by Jiaxin Jiang, Xi Chen, Zexing Mei, Huatan Chen, Junyu Chen, Xiang Wang, Shufan Li, Runyang Zhang, Gaofeng Zheng and Wenwang Li
Micromachines 2024, 15(3), 333; https://doi.org/10.3390/mi15030333 - 28 Feb 2024
Viewed by 777
Abstract
Flexible devices have extensive applications in areas including wearable sensors, healthcare, smart packaging, energy, automotive and aerospace sectors, and other related fields. Droplet printing technology can be utilized to print flexible electronic components with micro/nanostructures on various scales, exhibiting good compatibility and wide [...] Read more.
Flexible devices have extensive applications in areas including wearable sensors, healthcare, smart packaging, energy, automotive and aerospace sectors, and other related fields. Droplet printing technology can be utilized to print flexible electronic components with micro/nanostructures on various scales, exhibiting good compatibility and wide material applicability for device production. This paper provides a comprehensive review of the current research status of droplet printing technologies and their applications across various domains, aiming to offer a valuable reference for researchers in related areas. Full article
(This article belongs to the Special Issue Flexible and Wearable Sensors, 3rd Edition)
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