Conferences
8–10 August 2023, Xinjiang, China
The International Conference on Electronic Packaging Technology (ICEPT)
The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic conferences, and is hosted by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT), and is organized by the Beijing branch of IEEE-EPS and Bei Jing Heng Ren Zhi Xin Consulting Company, China. ICEPT is held in China every year, with conference topics including Packaging Design, Manufacturing Technologies, R&D, Photonics, MEMS, System Integrated Packaging, etc. Since it was inaugurated in 1994, ICEPT has been held by the Tsinghua University, Fudan University, Harbin Institute of technology, Huazhong University of Science and Technology, Shanghai Jiaotong University, Xi'an University of Electronic Science and Technology, Shanghai University, Guilin University of Electronic Science and Technology, Dalian University of Technology, University of Electronic Science and Technology, Central South University, Hong Kong University of Science and Technology, Guangdong University of Technology, and other universities for more than 20 sessions. It is supported by relevant government units at all levels. ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers, more than 500 well-known experts, scholars, and business people from about 20 countries and regions.
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