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Flexible Thermoelectric Materials and Devices

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Energy Materials".

Deadline for manuscript submissions: closed (20 May 2022) | Viewed by 427

Special Issue Editor

Carbon Composite Materials Research Center Korea Institute of Science and Technology (KIST) 92, Chudong-ro, Bongdong-eup, Wanju-gun, Jeollabuk-do 55324, Korea
Interests: energy devices; flexible thermoelectric devices; thermal transport; thermal properties measurement technology

Special Issue Information

Dear Colleagues,

Thermoelectric phenomena, which directly convert heat energy into electricity, have the potential to be used commercially for waste-heat harvesting systems or alternative cooling systems. Recently, thermoelectric devices have attracted attention as alternative power sources of wearable or wireless devices and local cooling systems for the human body or hot spots, and have the advantages of stability, quietness, and reliability due to a lack of moving parts. Therefore, these thermoelectric materials and devices can be used to explore future applications with flexibility and stretchability.

Flexible thermoelectric materials and devices consist of inorganic or organic materials. Enhancing the flexibility of materials and devices with inorganic materials is an approach that can be used to obtain flexible thermoelectric devices. The low performance of organic materials and carbon-based materials such as carbon nanotubes and graphene, in comparison to that of inorganic materials, is a remaining issue. This Special Issue on “Flexible Thermoelectric Materials and Devices” is dedicated to novel approaches to thermoelectric materials and devices with flexibility and stretchability. We are soliciting original experimental and theoretical approaches associated with flexible inorganic or organic materials. This Special Issue covers a broad range of fundamental concepts, as well as experimental and theoretical studies related to flexibility and thermoelectricity and applications with new ideas for devices structures and new approaches for high-performance devices.

We kindly invite you to submit your research contributions in the form of research articles (full papers), communications, or reviews to this Special Issue.

Dr. Jungwon Kim
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible thermoelectric materials
  • flexible thermoelectric devices
  • stretchable thermoelectric materials
  • stretchable thermoelectric devices
  • inorganic thermoelectric
  • organic thermoelectric
  • inorganic/organic thermoelectric

Published Papers

There is no accepted submissions to this special issue at this moment.
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