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Plasma Processing of Materials: Applications and Opportunities

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (10 March 2024) | Viewed by 370

Special Issue Editor


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Guest Editor
Graduate Institute of Applied Mechanics and Advanced Research Center for Green Materials Science and Technology, National Taiwan University, Taipei 10617, Taiwan
Interests: plasma technology on materials processing; solar cell; water splitting; hydrogen generation; supercapacitor; redox flow cell; fuel cell; battery; flexible electronics
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Special Issue Information

Dear Colleagues,

Plasma technology is a versatile tool that has been applied in many material surface modification and deposition processes. Non-thermal low-pressure plasma has been extensively used in industry. Recent developments in atmospheric-pressure plasma has widened plasma applications in regular-pressure environments and roll-to-roll processes. Abundant ions and electrons of plasmas are highly reactive with many materials. These reactive plasma species, in conjunction with heat and ion bombardment effect, create many material processing possibilities, enabling ultrafast material processing capability and rapid surface activation and cleaning. Plasma has been applied in many material processes, such as plasma polymerization, sputtering, plasma spray, plasma grafting, plasma etching, plasma surface modification and treatment of materials, plasma surface cleaning, prior thin film deposition or glue bonding, and interfacial engineering.

This Special Issue encompasses all plasma processes related to materials; for example, plasma polymerization, plasma surface treatment and modification of materials, plasma treatment prior to coatings, plasma processing for composites, plasma etching of materials, plasma grafting, plasma syntheses of organic–inorganic hybrid materials, and interfacial engineering of materials. Papers concerning material characterizations of plasma-processed materials and new applications of plasma technology to material processing are all invited.

Prof. Dr. Jian-Zhang Chen
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • low-pressure plasma
  • non-thermal plasma
  • atmospheric pressure plasma
  • dielectric barrier discharge
  • corona discharge
  • etching
  • surface treatment
  • surface modification
  • plasma polymerization
  • metals
  • alloys
  • ceramics
  • semiconductors
  • conductive polymer
  • polymer
  • composites
  • organic–inorganic hybrid materials
  • surface coating
  • paint
  • adhesion
  • bonding

Published Papers

There is no accepted submissions to this special issue at this moment.
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