Special Issue "Emerging Interconnection Networks Across Scales"
A special issue of Journal of Low Power Electronics and Applications (ISSN 2079-9268).
Deadline for manuscript submissions: closed (15 December 2018) | Viewed by 27274
Interests: interconnection network; Network-on-Chip (NoC); multi-chip system integration; wireless interconnects; data center networks
Special Issues, Collections and Topics in MDPI journals
With the advent of multicore or manycore processors, the interconnection architecture on Multi-Processor System-on-Chips shifted from the bus-based methodology towards the Network-on-Chip paradigm. However, due to issues of unpredictable latencies and power consumption over multi-hop metal/dielectric paths, emerging interconnection architectures with monolithic 3D integration, photonic, RF and wireless interconnections are being investigated. On the other hand, multi-chip systems, such as blade servers and embedded systems, require efficient high bandwidth interconnections between processors and memory subsystems. Traditional I/O and packaging techniques suffer from non-scalable analog designs pin densities. Therefore, the performance gap between on-chip and off-chip interconnects is expected to widen. Moreover, in the era or cloud services and Internet-of-Things (IoTs), chip-to-chip interconnects will need to provide seamless integration of heterogeneous architectures on the same platform which may range from ASICs, FPGA, multi/manycore CPUs and GPUs. On the other side of the spectrum, data centers, which provide the storage and computational backbone of the modern digital world have extremely high power consumption. Data center networks, interconnecting thousands of servers, result in increasing power consumption with the increase in network performance. All these factors require interconnection networks, connecting either many cores within a die, processors within a server or servers within a data center, to extremely energy efficient while supporting the necessary performance. The issue of security and privacy in these interconnection fabrics also need to be specifically tailored for their operating environments. This would naturally need innovative solutions, encompassing physical layer, routing protocols, as well as architectures, and carefully establish design trade-offs.
To advance and capture the recent and future innovations in interconnection technology at multiple scales, such as on-chip networks, chip-to-chip interconnections and data center networks, the proposed Special Issue of JLPEA will be dedicated towards innovative ways of interconnecting electronic devices. The readers of this Special Issue will be able to familiarize themselves with the recent advances in these technology paradigms, while also discovering the common and disparate issues about these interconnections at these various scales. Original contributions from the following non-exhaustive list of topics are solicited:
- Power efficiency in Network-on-Chip
- Chip-to-chip interconnections
- Interconnections for heterogeneous systems
- Dynamic interconnection networks
- Data center networks
- 3D NoC
- Photonic/optical interconnects
- RF interconnections
- Wireless interconnects
- Millimeter-wave wireless communication for computing platforms
- THz band communications for computing systems
- Security and Privacy in NoC
- Data center network security and privacy
- Congruence of interconnection networks with IoT
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Low Power Electronics and Applications is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Chip-to-Chip interconnection
- Multi-chip integration
- Data center Network
- Emerging interconnection technologies
- 3D integration
- Photonic/Optical interconnects
- RF interconnects
- Wireless interconnects