Special Issue "Advanced High-Performance Integrated Circuits for Sensing Technologies and IoT Applications"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: 15 November 2023 | Viewed by 209

Special Issue Editor

Department of Electrical Engineering, Linköping University, 581 83 Linköping, Sweden
Interests: analog/RF microelectronics; low-power microsystems; on-chip power management; energy harvesting; wireless energy/power transfer; low-power transceivers

Special Issue Information

Dear Colleagues,

Today, sensing technologies and sensor-enabled devices are gaining attention, with a wide range of potential applications, ranging from internet of things (IoT), intelligent transportation systems (ITS) to personalized mobile healthcare. These tasks are mostly through wireless connections. Power dissipation, bandwidth efficiency, design flexibility, and scalability are important factors for these systems. However, there are still many challenges that must be addressed. Examples of such challenges in these technologies include effect of size constraints on the performance in many applications, mW-level power consumption of electronic circuits which limits the sensory systems' lifetime, compatibility with existing communication protocols, etc.

Within this framework, the aim of this Special Issue is to encourage researchers to submit their original research and reviews, addressing the latest developments, innovations, and challenges related to the design of advanced high-performance integrated circuits for sensing technologies and IoT applications.

Topics of interest for this Special Issue include, but are not limited to, the following areas:

  • Ultra-low power wireless communication circuits enabling IoT applications
  • High efficient load modulation techniques and backscattering solutions
  • Energy harvesting and power management solutions for IoT devices
  • Integrated circuits with wireless power transfer capability
  • Ultra-low power sensor readout circuits and systems
  • High-performance heterogeneous solutions for emerging technologies
  • Multi-sensor miniaturized circuits and systems

Dr. Alireza Saberkari
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • energy harvesting
  • ultra-low-power IoT
  • wakeup receivers
  • ultra-low power transceivers
  • backscattering
  • load modulation
  • sensing technologies
  • sensor readout circuits
  • low power integrated circuits

Published Papers

This special issue is now open for submission.
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