Special Issue "High Electron Mobility Transistor (HEMT) Devices and Applications"

A special issue of Crystals (ISSN 2073-4352). This special issue belongs to the section "Materials for Energy Applications".

Deadline for manuscript submissions: 31 March 2024 | Viewed by 1475

Special Issue Editors

Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, USA
Interests: GaN; HEMTs; wide bandgap material; RF transistor; power electronics; transistor modeling
School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe City, AZ 85281, USA
Interests: wide and ultrawide bandgap semiconductors; power electronics; optoelectronics; extreme-environment devices
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Special Issue Information

Dear Colleagues,

Ever since the demonstration of the first high-electron mobility transistors (HEMTs) by Dr. Mimura in 1981, HEMTs have been developed rapidly and commercialized in different material systems for a myriad of applications. At the early development stage, AlGaAs/GaAs, GaAs/InGaAs, and InP-based HEMTs were widely implemented into high-speed electronics communication applications with excellent noise and power performance. The development of GaN HEMTs has opened the gate to more applications, such as power electronics, mm-wave frequency systems, biosensing, and radiation-hardened electronics. Recently, ultrawide bandgap materials such as AlGaN- and Ga2O3-based HEMTs have been introduced and demonstrated encouraging results. This Special Issue will cover innovative HEMT devices, applications based on HEMT technology, HEMT-related material research, including epitaxy growth, material characterization, and fabrication techniques, and HEMT simulation.

Dr. Weiyi Li
Prof. Dr. Houqiang Fu
Guest Editors

Manuscript Submission Information

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Keywords

  • high-electron mobility transistors
  • HEMT simulation
  • HEMT applications
  • HEMT heterostructure
  • gallium nitride
  • gallium arsenide
  • indium phosphide
  • ultrawide bandgap semiconductors

Published Papers (1 paper)

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Research

10 pages, 3242 KiB  
Communication
Highly Reliable Temperature Sensor Based on p-GaN/AlGaN/GaN Hybrid Anode Diode with Wide Operation Temperature from 73 K to 573 K
Crystals 2023, 13(4), 620; https://doi.org/10.3390/cryst13040620 - 04 Apr 2023
Cited by 1 | Viewed by 904
Abstract
A high-performance temperature sensor based on a p-GaN/AlGaN/GaN hybrid anode diode (HPT-HAD) fabricated by hydrogen plasma treatment is demonstrated. The sensor exhibits accurate and stable temperature responses from 73 to 573 K. The forward anode voltage is linearly proportional to the temperature over [...] Read more.
A high-performance temperature sensor based on a p-GaN/AlGaN/GaN hybrid anode diode (HPT-HAD) fabricated by hydrogen plasma treatment is demonstrated. The sensor exhibits accurate and stable temperature responses from 73 to 573 K. The forward anode voltage is linearly proportional to the temperature over the measured temperature range at a fixed current. At a forward current density of 10−7 mA/mm, the device achieves a maximum sensitivity of 1.93 mV/K. The long-time anode current stress measurement reveals that the HPT-HAD shows almost no degradation even at 573 K for 1 h at a current of 100 μA, and the anode voltage shifts only 120 mV at 573 K for 1000 s at 1 nA. This work shows that the HPT-HAD temperature sensor can be reliably operated over a wide temperature range from cryogenic to high temperatures, so can be used in a variety of extreme environments. Full article
(This article belongs to the Special Issue High Electron Mobility Transistor (HEMT) Devices and Applications)
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