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Coatings for Advanced Devices
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Coatings for Advanced Devices

A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Surface Engineering for Energy Harvesting, Conversion, and Storage".

Deadline for manuscript submissions: 20 June 2024 | Viewed by 6052

Special Issue Editor

Prof. Dr. Xu Long

E-Mail Website
Guest Editor
School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, China
Interests: multiscale modelling; constitutive damage model; instrumented in situ indentation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

I would like to invite you to submit your work to this Special Issue on "Coatings for Advanced Devices".

As promising solutions in various practical and future applications, advanced devices have been developing rapidly in recent years, such as micro-electronics, optoelectronics, display panels, wearable personal healthcare, and many other devices. Thin film/substrate systems are significant in numerous critical engineering applications with the processing techniques of sputtering, vapor deposition, ion implantation, and laser glazing. The reliability of advanced devices relies primarily on how reliably the thin film/substrate works, thus the adhesion of thin film on the substrate has been of great significance as the interface. To address the severe challenges caused by harsh operating conditions in advanced devices, new coating methods and materials need to be developed, and thus, new coating technologies for advanced devices and substrates are necessary.

The Editor of the journal and the Special Issue will consider proposed publications in all areas related to new approaches in the synthesis, characterization, and evaluation of coatings and their interfacial effects on the substrate and the overall functions. The Special Issue highlights the opportunities and challenges in broadening the applications of coatings in advanced devices. For original research articles and reviews, the topics of interest include, but are not limited to:

  • Electronic packaging for devices;
  • Interface and surface reaction for joining materials;
  • Processes for coating deposition and modification;
  • Characterization and the corresponding methods of coatings;
  • Evaluation and the corresponding methods of coatings;
  • Coatings for high-temperature application;
  • Fundamental and functional properties of surface and interfaces.

Prof. Dr. Xu Long
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • WBG power device packaging
  • coatings or plating technology
  • interface and surface reaction
  • Pb-free solder
  • Ag or Cu sinter joining
  • evolution of interface
  • high temperature application
  • properties of surface and interfaces
  • applied surface science

Published Papers (4 papers)

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Research

24 pages, 21296 KiB  
Article
Effects of Pd Alloying and Coating on the Galvanic Corrosion between Cu Wire and Bond Pads for a Semiconductor Packaging
by Young-Ran Yoo and Young-Sik Kim
Coatings 2024, 14(5), 544; https://doi.org/10.3390/coatings14050544 - 27 Apr 2024
Viewed by 239
Abstract
Semiconductor chips are packaged in a process that involves creating a path to allow for signals to be exchanged with the outside world and ultimately achieving a form to protect against various external environmental conditions such as heat and moisture. The wire bonding [...] Read more.
Semiconductor chips are packaged in a process that involves creating a path to allow for signals to be exchanged with the outside world and ultimately achieving a form to protect against various external environmental conditions such as heat and moisture. The wire bonding type of packaging is a method in which thin metal wires are bonded to pads to create an electrical connection between the chip and the lead frame. An Epoxy Molding Compound (EMC) can be applied to protect semiconductor chips from external environmental conditions such as heat, shock, and moisture. However, EMC contains halogen elements and sulfides and has hydrophilic properties, which can lead to a corrosive environment. The present study aims to evaluate the influence of chloride, which is a contaminant formed during the PCB manufacturing process. To this end, the galvanic corrosion of bonding wire materials Cu wire, Cu wire alloyed with 1% Pd, and Cu wire coated with Pd was investigated. The first ball bond was bonded to the Al pad and the second stitch bond was bonded to the Au pad of the manufacturing process, after which the galvanic corrosion behavior in the semiconductor packaging module specimen was analyzed. A model of galvanic corrosion behavior was also proposed. Full article
(This article belongs to the Special Issue Coatings for Advanced Devices)
14 pages, 8862 KiB  
Article
Viscoelastic Simulation of Stress and Warpage for Memory Chip 3D-Stacked Package
by Xiyou Wang, Sicheng Cao, Guangsheng Lu and Daoguo Yang
Coatings 2022, 12(12), 1976; https://doi.org/10.3390/coatings12121976 - 16 Dec 2022
Viewed by 1284
Abstract
Three-dimensional-stacked packaging technology is widely used in memory chip packaging, which can greatly increase the utilization ratio of the packaging area. However, problems with the reliability of 3D-stacked packaging are also becoming more and more serious. In this paper, first, a dynamic mechanical [...] Read more.
Three-dimensional-stacked packaging technology is widely used in memory chip packaging, which can greatly increase the utilization ratio of the packaging area. However, problems with the reliability of 3D-stacked packaging are also becoming more and more serious. In this paper, first, a dynamic mechanical analyzer is used to obtain the EMC viscoelasticity parameters. Then, the influence trend of different factors, such as EMC, die bond material and chip, on the performance of the memory chip 3D-stacked packaging under a fixed temperature cyclic loading condition is explored by the FE method. Full article
(This article belongs to the Special Issue Coatings for Advanced Devices)
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14 pages, 4160 KiB  
Article
Dimensionless Analysis to Determine Elastoplastic Properties of Thin Films by Indentation
by Xu Long, Jiao Li, Ziyi Shen and Yutai Su
Coatings 2022, 12(11), 1768; https://doi.org/10.3390/coatings12111768 - 18 Nov 2022
Cited by 9 | Viewed by 1555
Abstract
By assuming the elastoplastic properties of thin-film materials, a reverse analysis method is proposed by deriving a dimensionless function for the indentation process. The substrate effect is taken into account by assuming a perfect interface between thin-film and substrate materials. In order to [...] Read more.
By assuming the elastoplastic properties of thin-film materials, a reverse analysis method is proposed by deriving a dimensionless function for the indentation process. The substrate effect is taken into account by assuming a perfect interface between thin-film and substrate materials. In order to obtain the applied load–penetration depth (P-h) curves, the indentation process is numerically modeled as an axisymmetric problem with a rigid-body Berkovich indenter on the semi-infinite substrate when performing finite element (FE) simulations. As a typical soft film/hard substrate problem, the elastic substrate is assumed and the power–law model is used to describe the constitutive properties of thin-film materials. Varying elastic modulus (10–50 GPa), yield strength (60–300 MPa), and hardening exponent (0.1–0.5) characterize different elastoplastic mechanical properties of thin-film materials with film thickness of 10–30 μm. Owing to the good trending P-h curves with the maximum indentation depth up to the 2/3 film thickness for different elastoplastic thin-film materials, a dimensionless function is derived and validated based on the predictions by reliable FE simulations. The proposed dimensionless function elegantly elucidates the essential relationship between the elastoplastic mechanical properties of the thin-film material and indentation responses (e.g., loading and unloading variables). The elastoplastic constitutive curves predicted by the proposed reverse method are confirmed to be in good agreement with the stress-strain curves of materials by FE simulations with the randomly selected elastoplastic mechanical properties and film thicknesses. This study provides a theoretical guidance to understand the explicit relationship between elastoplastic mechanical properties of the thin-film material and indentation responses. Full article
(This article belongs to the Special Issue Coatings for Advanced Devices)
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17 pages, 4936 KiB  
Article
Tunable Coefficient of Thermal Expansion of Composite Materials for Thin-Film Coatings
by Xu Long, Tianxiong Su, Zubin Chen, Yutai Su and Kim S. Siow
Coatings 2022, 12(6), 836; https://doi.org/10.3390/coatings12060836 - 15 Jun 2022
Cited by 2 | Viewed by 1806
Abstract
In most engineering applications, the coefficients of thermal expansion (CTEs) of different materials in integrated structures are inconsistent, especially for the thin-film multilayered coatings. Therefore, mismatched thermal deformation is induced due to temperature variation, which leads to an extreme temperature gradient, stress concentration, [...] Read more.
In most engineering applications, the coefficients of thermal expansion (CTEs) of different materials in integrated structures are inconsistent, especially for the thin-film multilayered coatings. Therefore, mismatched thermal deformation is induced due to temperature variation, which leads to an extreme temperature gradient, stress concentration, and damage accumulation. Controlling the CTEs of materials can effectively eliminate the thermally induced stress within the layered structures and thus considerably improve the mechanical reliability and service life. In this paper, randomly distributed fibers are incorporated into the matrix material and thus utilized to tune the material CTE from the macroscopical viewpoint. To this end, finite element (FE) modeling is proposed for fiber-reinforced matrix composites. In order to overcome the challenges of creating numerical models at a mesoscale, the random distribution of fibers in three-dimensional space is realized by proposing a fiber growth algorithm with the control of the in-plane and out-of-plane angles of fibers. The homogenization method is adopted to facilitate the FE simulations by using the representative volume element (RVE) of composite materials. Periodic boundary conditions (PBC) are applied to realize the prediction of the equivalent CTE of macroscopic composite materials with randomly distributed fibers. In the established FE model, the random distribution of carbon fibers in the matrix makes it possible to tune the CTE of the composite material by considering the orientation of fibers in the matrix. The FE predictions show that the volume fraction of carbon fibers in the composite materials is found to be crucial to macroscopic CTE, but results in minor variations in Young’s modulus and shear modulus. With the developed ABAQUS plug-in program, the proposed tuning method for CTE is promising to be standardized for industrial practice. Full article
(This article belongs to the Special Issue Coatings for Advanced Devices)
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