Core/Shell Nanowires: Design and Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".

Deadline for manuscript submissions: closed (30 September 2022) | Viewed by 317

Special Issue Editor


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Guest Editor
Department of Materials Science, University of Milano-Bicocca, 20125 Milan, Italy
Interests: epitaxy; crystal growth modeling; semiconductors; phase-field; nanostructures
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Core–shell nanowires are a unique kind of heterostructure, combining the peculiar properties of one-dimensional nanostructuring with the flexibility and tailoring opportunities offered by the integration of different materials. Intense research has arisen around this architecture in view of the potential breakthrough applications for next-generation technologies, from opto-electronics to quantum computing, photovoltaics, sensing, etc. The possibility of creating a wide variety of materials, semiconductors, metals and oxides in the form of core–shell nanowires is key for enabling such a broad spectrum of uses, driving a constant development of growth techniques, as well as models for the optimization and control of the process. Finding the subtle connections between the structure, geometry and material combination and the resulting properties is essential for tailoring the design and, eventually, exploring novel configurations targeting the application demands by, e.g., strain/band engineering, quantum confinement and phase-templating.

This Special Issue is intended as a recognition of the state-of-the-art and novel developments regarding core–shell nanowires and, as such, the scope covers all aspects related to their growth, characterization and application, main topics including:

  • Growth experiments, deposition techniques and materials;
  • Structural properties, defects and strain effects;
  • Structure–properties relation and tunability;
  • Characterization and measure of the material properties;
  • Modeling and simulations;
  • Applications and novel frontiers in micro-electronics, photonics, energy production and conversion, sensing, etc.

Scientists working in the field are invited to contribute to this Special Issue with original research manuscripts or reviews.

Dr. Roberto Bergamaschini
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nanowires
  • core–shell
  • epitaxy
  • defects
  • strain relaxation
  • band engineering
  • compositional segregation
  • radial heterostructures

Published Papers

There is no accepted submissions to this special issue at this moment.
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