Millimeter-Wave and THz Integrated Technologies and Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: 20 June 2024 | Viewed by 265
Special Issue Editor
Special Issue Information
Dear Colleagues,
The aggressive downscaling of CMOS and III-V semiconductor technologies opens up new perspectives for the development of circuits and systems operating at millimeter-wave and THz frequencies. This concerns a wide range of applications including medical applications, security screening, communications and sensing. However, the development of highly miniaturized and complete THz systems still poses major challenges, some of which are related to the accessibility of accurate device models, the hybrid integration of various technologies, the development of suitable packaging technologies and the availability of established, accurate, on- and off-wafer characterization tools and methodologies.
This Special Issue will present recent advances and novel ideas that demonstrate progress in those fields. It will publish high-quality, original research papers on the following topics:
- Semiconductor CMOS (bulk, FD and PD SOI, FinFETs, nanowires, etc.) and III-V (GaAs, InP, GaN, etc.) technologies, substrates and devices for mmWave and THz circuits;
- State-of-the-art integrated mmWave and THz active (LNA, PA, mixers, oscillators, beamformers, antennas, detectors, etc.) and passive (transmission lines, couplers, filters, etc.) circuits and systems;
- Packaging and interposer technologies for compact mmWave and THz system development;
- On- and off-wafer tools and methodologies for accurate and efficient mmWave and THz technologies, circuits and system (S-parameter, noise, large-signal, etc.) characterization.
Prof. Dr. Dimitri Lederer
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- mmWave and THz integrated technologies, devices and circuits
- mmWave and THz device modeling
- hybrid integration and packaging technologies for mmWave and THz circuits and systems
- mmWave and THz on-wafer characterization techniques and methodologies
- emerging mmWave and THz applications
