Artificial Intelligence in Material Science and Failure Analysis
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".
Deadline for manuscript submissions: closed (30 March 2024) | Viewed by 159
Special Issue Editors
Interests: material and damage analytics; thin films; mechanical properties; laser ultrasound
Special Issues, Collections and Topics in MDPI journals
Interests: reliability and analytics for assembly and interconnects; assembly and interconnect technology; reliability testing; microelectronics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We invite contributions ranging from experimental techniques to data analysis to drive applied material science and modern failure analysis. The aim of this Special Issue is to incorporate and combine topics such as the development and application of (1) experimental methods and methodological workflows for modern material research and reliability testing, (2) computational modelling and simulations, and (3) artificial intelligence-based concepts for advanced data analysis and embedded computing systems. This Special Issue will address, but is not limited to, material-related topics in the field of energy storage and conversion, microelectronics, powers semiconductors, additive manufacturing, lightweight materials, etc.
Dr. Roland Brunner
Dr. Elke Kraker
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- machine learning
- artificial intelligence
- imaging
- image analysis
- material characterization
- failure analysis
- energy storage and conversion
- microelectronics
- additive manufacturing
- lightweight materials
- modeling and simulation
- embedded computing
