Building Information Modeling (BIM): Advance and Future Trends

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Civil Engineering".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 180

Special Issue Editor


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Guest Editor
Research Group EgiCAD, School of Civil Engineering, Geographical Engineering and Graphic Expression Techniques, Universidad de Cantabria, Santander, Spain
Interests: BIM; tensegrity; augmented reality; virtual reality

Special Issue Information

Dear Colleagues,

This Special Issue aims to identify the key pathways that the BIM methodology will need to follow in the future to address the challenges, needs, and uncertainties in the AEC sector.

In recent years, the advancement of the BIM methodology has been evolving through standards, revisions, updates, and improvements, with the goal of finding the essential elements that will make it the perfect technology for the construction industry. With the idea of completing the concept of a virtual model and digital twin, BIM is conceived as a methodology that creates a unique model for each project, allowing for digital design simulations, with a focus on information, transparency, and collaboration.

However, what are the current seeds that will sprout to meet the future needs of the industry and construction? Connectivity and programming are the keys to the future after BIM, but we must not forget the potential of artificial intelligence, applied Big Data, and machine learning.

The potential topics of this Special Issue include, but are not limited to:

  • New perspectives and trends in Building Information Modeling (BIM).
  • Simulations with virtual models and digital twins through BIM.
  • Virtual reality, augmented reality, mixed reality, and extended reality with BIM.
  • Connectivity of the real world with BIM projects.
  • Programming on BIM.
  • Computational and data science applied to BIM.
  • Big data applications, algorithms, and systems on BIM.
  • Evolution of BIM
  • Innovative solutions on BIM for the construction industry.
  • Artificial intelligence, machine learning, and deep learning applied to BIM.
  • Development of software for new solutions on BIM.
  • BIM and new materials.

I hope you will contribute your high-quality research and I look forward to reading your valuable results.

Dr. Valentin Gomez-Jauregui
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • BIM
  • programming
  • connectivity
  • virtual reality
  • augmented reality
  • mixed reality
  • extended reality
  • big data
  • AI
  • machine learning
  • deep learning

Published Papers

This special issue is now open for submission.
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