Current Trend of High Temperature and Pressure Materials in Hypersonic Vehicles

A special issue of Aerospace (ISSN 2226-4310). This special issue belongs to the section "Aeronautics".

Deadline for manuscript submissions: 30 June 2024 | Viewed by 132

Special Issue Editors

Department of Mechanical Engineering, Keimyung University, Daegu 42601, Republic of Korea
Interests: shock waves; nanotechnology

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Guest Editor
Department of Mechanical and Biomedical Engineering, Kangwon National University, 1, Kangwondaehak-Gil, Chuncheon, 24341, Republic of Korea
Interests: hypersonic flow; numerical methods, thermochemical nonequilibrium

Special Issue Information

Dear Colleagues,

High-temperature and -pressure materials are important for aerospace applications, where their primary function is to endure and disperse the extreme forces and temperatures produced by shock waves during high-speed flight and supersonic travel. In materials science and aerospace research, shock wave recovery in materials, particularly solids, is a relatively novel technique to determine the stability of the materials’ properties under dynamic high-pressure and -temperature conditions. Typically characterized by their exceptional high-temperature resistance, superior strength, and lightweight attributes, high-temperature and high-pressure materials find their utilization in critical aerospace components like heat shields, nose cones, and leading edges. Finding new materials that can maintain their function under high-speed and high-pressure conditions is essential for enhancing the performance of hypersonic vehicles.

Materials scientists have been drawn to the behavior changes induced by shock waves in crystalline and non-crystalline materials. Understanding the interaction of these materials with shock waves is essential for developing new advanced high-temperature materials. This Special Issue aims to provide the current state of engineering technology as well as fundamental concepts for a thorough understanding of the complex physics of dynamic waves on high-temperature materials for aerospace applications. Therefore, we can benefit from this newly released Special Issue that explores the subject of shock wave interactions with materials. We believe this Special Issue will inspire scientists to broaden the scope of their shock wave research and provide beneficial insights into the application of shock waves on materials and their systems.

Dr. Ikhyun Kim
Dr. Yosheph Yang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Aerospace is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • shock waves
  • high-temperature material
  • hypersonic flow
  • material–environment interaction

Published Papers

This special issue is now open for submission.
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