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Editorial

Statement of Peer Review †

1
Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
2
Department of Recreation and Health Care Management, Chia Nan University of Pharmacy & Science, Tainan City 71710, Taiwan
3
Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
4
Department of Aeronautical Engineering, Chaoyang University of Technology, Taichung 413, Taiwan
*
Authors to whom correspondence should be addressed.
All papers published in this volume are presented at the IEEE 5th Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability, Tainan, Taiwan, 2–4 June 2023.
Eng. Proc. 2023, 55(1), 1; https://doi.org/10.3390/engproc2023055001
Published: 21 November 2023
In submitting the conference proceedings of the 5th IEEE Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability 2023 (IEEE ECBIOS 2023) to Engineering Proceedings, the volume editors certify to the publisher that all papers published in this volume have been subjected to peer review administered by the volume editors. Reviews were conducted by expert referees to the professional and scientific standards expected of a Proceedings journal.
  • Type of peer review: 2–3 reviews that were single-blind;
  • Conference submission management system: https://2023.ecbios.asia/; (Accessed on 1 January 2023)
  • Number of submissions sent for review: 196;
  • Number of submissions accepted: 105;
  • Acceptance rate: 0.536;
  • Average number of reviews per paper: 2;
  • The total number of reviewers involved: 50;
  • Any additional information on the review process: please refer to Figure 1.
Figure 1. Review process for conference proceedings of the 5th IEEE Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability 2023 (IEEE ECBIOS 2023).
Figure 1. Review process for conference proceedings of the 5th IEEE Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability 2023 (IEEE ECBIOS 2023).
Engproc 55 00001 g001

Author Contributions

All authors contributed equally to this paper. All authors have read and agreed to the published version of the manuscript.

Funding

This statement of peer review received no external funding.

Institutional Review Board Statement

Not applicable.

Informed Consent Statement

Not applicable.

Data Availability Statement

Conflicts of Interest

The authors declare no conflict of interest.
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.

Share and Cite

MDPI and ACS Style

Meen, T.-H.; Hsu, K.-S.; Yang, C.-F. Statement of Peer Review. Eng. Proc. 2023, 55, 1. https://doi.org/10.3390/engproc2023055001

AMA Style

Meen T-H, Hsu K-S, Yang C-F. Statement of Peer Review. Engineering Proceedings. 2023; 55(1):1. https://doi.org/10.3390/engproc2023055001

Chicago/Turabian Style

Meen, Teen-Hang, Kuei-Shu Hsu, and Cheng-Fu Yang. 2023. "Statement of Peer Review" Engineering Proceedings 55, no. 1: 1. https://doi.org/10.3390/engproc2023055001

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