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Engineering Proceedings
Volume 38
Issue 1
10.3390/engproc2023038001
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Editorial

Statement of Peer Review †

by
Teen-Hang Meen
1,*,
Hsin-Hung Lin
2 and
Cheng-Fu Yang
3,4,*
1
Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
2
Department of Creative Product Design, Asia University, Taichung 413, Taiwan
3
Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
4
Department of Aeronautical Engineering, Chaoyang University of Technology, Taichung 413, Taiwan
*
Authors to whom correspondence should be addressed.
†
All proceeding papers published in the volumes are presented at the 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data Conference 2023, Taichung, Taiwan, 14–16 April 2023.
Eng. Proc. 2023, 38(1), 1; https://doi.org/10.3390/engproc2023038001
Published: 16 June 2023
(This article belongs to the Proceedings of The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023)
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Versions Notes
In submitting conference proceedings of the 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023) to Engineering Proceedings, the volume editors of the proceedings certify to the publisher that all papers published in this volume were subjected to peer review arranged by the volume editors. The reviews were conducted by expert referees according to the professional and scientific standards expected of a proceedings journal:
  • Type of peer review: two to three reviews by single-blinded reviewers.
  • Conference submission management system: http://www.iceib.asia/.
  • Number of submissions sent for review: 196.
  • Number of submissions accepted: 91.
  • Acceptance rate: 0.464.
  • Average number of reviews per paper: two.
  • Total number of reviewers involved: 50.
  • Any additional information on the review process: Please refer to Figure 1.

Conflicts of Interest

The authors declare no conflict of interest.
Engproc 38 00001 g001 550
Figure 1. Review process for conference proceedings of the 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023).
Figure 1. Review process for conference proceedings of the 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023).
Engproc 38 00001 g001
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.

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MDPI and ACS Style

Meen, T.-H.; Lin, H.-H.; Yang, C.-F. Statement of Peer Review. Eng. Proc. 2023, 38, 1. https://doi.org/10.3390/engproc2023038001

AMA Style

Meen T-H, Lin H-H, Yang C-F. Statement of Peer Review. Engineering Proceedings. 2023; 38(1):1. https://doi.org/10.3390/engproc2023038001

Chicago/Turabian Style

Meen, Teen-Hang, Hsin-Hung Lin, and Cheng-Fu Yang. 2023. "Statement of Peer Review" Engineering Proceedings 38, no. 1: 1. https://doi.org/10.3390/engproc2023038001

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