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Journal: Polymers, 2023
Volume: 15
Number: 1072

Article: Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process
Authors: by Yong-Min Lee, Kwan-Woo Kim and Byung-Joo Kim
Link: https://www.mdpi.com/2073-4360/15/5/1072

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