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Journal: Materials, 2021
Volume: 14
Number: 5342

Article: An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
Authors: by Sunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai and Kuo-Ning Chiang
Link: https://www.mdpi.com/1996-1944/14/18/5342

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