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Journal: Materials, 2021
Volume: 14
Number: 3799

Article: Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder
Authors: by Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui and Hirohiko Watanabe
Link: https://www.mdpi.com/1996-1944/14/14/3799

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