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Article
Peer-Review Record

Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring

Sensors 2022, 22(22), 8681; https://doi.org/10.3390/s22228681
by Kevin Mc Gee 1,2, Prince Anandarajah 3 and David Collins 1,2,*
Reviewer 1: Anonymous
Reviewer 2: Anonymous
Sensors 2022, 22(22), 8681; https://doi.org/10.3390/s22228681
Submission received: 19 October 2022 / Revised: 4 November 2022 / Accepted: 8 November 2022 / Published: 10 November 2022
(This article belongs to the Topic Recent Advances in Structural Health Monitoring)

Round 1

Reviewer 1 Report

As part of this work, the Authors presented the idea of using printed chipless RFID transponders as strain and temperature sensors in the Aerospace industry. The article is a work based on an experimental approach. As part of the work, the Authors prepared a review of the existing strain and temperature sensors, as well as the existing temperature sensors based on the RFID technology. Additionally, a chipless transponders interrogation system was presented, which enables the measurement of physical quantities on the basis of frequency changes in the response spectrum of identifiers. As part of the work, the Authors prepared two types of sensors made in different ways and with the use of different materials. As part of the research, the Authors carried out experiments proving the dependence of the zero frequencies of the tested transponders in function of the strain and temperature in various axes. It has also been proved that an appropriately built interrogation system is capable of detecting the changes of the mentioned frequencies. The current problems in the implementation of this type of measurement systems, resulting from the specific working conditions of RFID systems, were also indicated. In the opinion of the reviewer, the Authors presented an interesting solution, which, however, at the present stage of development, requires further research. A certain drawback of the presented work is the complete lack of mathematical or simulation models of the presented solution and, in the opinion of the reviewer, the development of such models should be the next stage of work in this field. In conclusion, I believe that the manuscript can be published as is.

Author Response

Please see the attachment.

Author Response File: Author Response.pdf

Reviewer 2 Report

This paper presents a chip-less approach for strain and temperature monitoring via printed antenna. The reviewer recommends the publication of the manuscript if the following issues are addressed constructively.

1)      Authors demonstrated frequency variations under strain and temperature. Are there any fluctuations when the resonator is tilted in a certain angle?

2)      Authors expect this technology can be applied to Structural Health Monitoring. When the system is applied to a certain substrate, are there any possible interferences? Perspectives and potential limitations should be commented.

Author Response

Please see the attachment.

Author Response File: Author Response.pdf

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