Advanced Materials for Printed Flexible Electronics
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Materials".
Deadline for manuscript submissions: closed (30 August 2023) | Viewed by 664
Special Issue Editor
Interests: materials; processes; designs and characterizations for flexible display & devices and printed electronics & devices; synthesis and application of nano materials; semiconductor materials; processes and devices; sensors on fiber; smart fabrics; supercapacitor; hydrogen storage materials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Mechanically durable and highly stretchable materials are fundamentally crucial for developing flexible and stretchable devices. Therefore, printed electronics have attracted considerable attention because they can be applied in healthcare, medicine, automotive, retail, wastewater treatment, agriculture, etc. Thus, much research is being done on flexible natural materials to allow smart devices to print on flexible, expandable, and portable substrates.
This special issue intends to provide the reader with an understanding of flexible electronics, from describing some of the applicable technologies to the approaches taken to overcome performance limitations and provide cost-effective solutions. Further, to highlight the fundamentals and design guides for flexible printed electronics, including historical perspectives, printing requirements for printable materials, design strategies, and advanced fabrication technologies for flexible printed electronics.
This issue aims to publish the latest research on advanced functional materials for various flexible electronics, such as metal oxide-, polymers-, ceramics-, nanoparticles-, 2D materials-, and nanocomposites-based flexible transistors, amplifiers, sensors, actuators, light-emitting diodes, photodetector arrays, photovoltaics, energy generation, and storage devices. Further, research related to the deposition of these new materials with state-of-the-art printing technology and understanding their interactions with various substrates, such as ultra-thin glass, polymer films, paper, and fibers, is suitable for publication in this issue.
It is my pleasure to welcome professors, researchers, scientists, and engineers from all over the globe to submit reviews, communications, and full papers on advanced materials for flexible electronics to this special issue.
Regards,
Prof. Dr. Jeong In Han
Guest Editor
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible electronics
- wearable technology
- flexible substrates
- flexible material
- flexible hybrid electronics
- additive manufacturing
- inkjet printing
- roll-to-roll printing
