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Wave and ICT Based Sensing and Characterization

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 2 August 2024 | Viewed by 1065

Special Issue Editor


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Guest Editor
School of Civil, Environmental and Architectural Engineering, Korea University, Seoul 02841, Republic of Korea
Interests: wave and ICT based characterization; pile foundation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Monitoring emergent phenomena in underground, such as in soils, rocks, and other geomaterials, is critical to ensure the safe design and maintenance of infrastructure. Recently, both conventional and innovative sensors have been used to measure and observe the emergent phenomena in geotechnical engineering. These sensors have been widely applied to evaluate the properties and parameters relevant to geotechnical engineering, and to compare the performance of sensors in geomaterials. Some examples of these sensors are as follows: bender elements, piezo disk elements, electrodes, manufactured electrical resistivity meters, (shock) accelerometers, geophones, piezoelectric ring actuators, time–domain reflectometry probes, X-ray computed tomography, strain gauges, coil sensors, thermocouples, fiber-optic sensors, piezoelectric sensors, smartrocks, MEMS, fiber gragg grating, fiber-reinforced polymers, and nano and pressure file sensors. Using these sensors, a wide variety of technological approaches can be developed, including machine learning analysis, mobile measurement systems, and observations using wearable devices.

The aims of this Special Issue are to highlight the recent advances in sensing and characterization based on waves and ICT in geotechnical engineering. Wave- and ICT-based sensing and characterization can be applied in the fields of subsurface characterization, nondestructive monitoring, offshore and onshore geotechnology, geo-energy recovery, geo-environmental engineering, road and pavement management, and engineered soils. This Special Issue also covers review papers or discussions on conventional and novel sensors based on waves and ICT in sensing and characterization for geotechnical engineering.

Prof. Dr. Jong-Sub Lee
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • elastic and electromagnetic waves
  • information and communication technology (ICT)
  • geophysical surveys
  • geotechnical properties and parameters
  • geotechnical imaging
  • machine learning
  • mobile measurement systems
  • wearable and wireless equipment
  • smart communication
  • non-destructive testing
  • numerical analysis

Published Papers

This special issue is now open for submission.
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