Silicon Photonics Packaging: Connecting Photonic Integrated Circuits with the Outside World
A special issue of Photonics (ISSN 2304-6732).
Deadline for manuscript submissions: 15 June 2024 | Viewed by 543
Special Issue Editors
Interests: integrated Si photonics; photonic packaging; semiconductor lasers; hybrid laser integration; 3D packaging
Interests: design and simulation of semiconductor lasers and si-photonics components; semiconductor processing of III-V edge-emitting lasers; design and development of semiconductor light emitter's characterization setups
Special Issue Information
Dear Colleagues,
We are pleased to invite you to contribute to the Special Issue dedicated to Si photonics packaging solutions.
After decades of academic research, silicon photonic integrated circuits (PICs) are widely deployed in industry nowadays. Several foundries offer Si photonics multi-project wafer (MPW) runs, which makes the technology accessible not only to corporations, but also to small research labs and early stage startups. After wafer- and die-scale lab testing, PICs require packaging into a durable module that will connect them to the outside world and protect them from harsh environments. In the next step of Si PIC productization, the packaging technology should ensure reliable operation, high PIC performance, and low cost. Thus, there will be significant momentum in academia and industry for developing and standardizing robust packaging solutions for fast Si PIC introduction.
This Special Issue aims to highlight the current progress and recent state-of-the-art in Si PIC packaging.
In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following: advanced fiber-to-PIC attachment (edge, grating, evanescent coupling), wafer-scale packaging, laser integration, micro-optics assembly, photonic MEMS packaging, electronic-photonic co-integration, and assembly thermal management.
We look forward to receiving your contributions.
Dr. Aleksandrs Marinins
Dr. Nouman Zia
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Si photonics
- photonic packaging
- co-packaged optics
- optical fiber
- semiconductor laser
- micro-optics
- MEMS
