3D Printing Technologies for Electroanalytical Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "C：Chemistry".
Deadline for manuscript submissions: closed (15 June 2023) | Viewed by 274
Special Issue Editors
Interests: 3D printing; miniaturized electroanalytical systems; batch injection analysis (BIA); analytical instrumentation; green chemistry
Interests: electroanalytical chemistry; microfluidics; paper-based analytical devices; 3D-printed sensors and devices; forensics
Special Issue Information
Dear Colleagues,
Three-dimensional (3D) printing or additive manufacturing is an emerging field which presents unique attractive advantages such as ability to create novel customized objects, the easy sharing of the files, the use of open-source software (modeling and slicing), large-scale production, relatively low cost, and the lower generation of residues in comparison to subtractive techniques. Many areas of science have benefited from 3D printing technology, including electrochemistry and analytical electrochemistry, confirmed by the exponential increase in the number of publications in the last five years. In this Special Issue titled “3D Printing Technologies for Electroanalytical Applications”, authors are invited to submit contributions related, but not limited to:
- 3D-printed electrodes, sensors and biosensors (e.g., development of new conductive filaments, novel modification and activation procedures and modification strategies);
- Development of 3D-printed microfluidic devices with electrochemical detection;
- Modeling of new electrochemistry accessories for electrochemistry (e.g., cells, devices and apparatus);
- Application of 3D-printed electrochemical devices for the electroanalysis of substances in samples of interest in many areas (e.g., food, clinical, environmental, forensic, pharmaceutical and agriculture);
- Use of different 3D-printing technologies (e.g., fused deposition modeling (FDM) and digital light processing (DLP)) and printing materials to obtain specific properties such as transparency, flexibility, chemical inertness or resistance (e.g., PLA, ABS, PETG, TPU for FDM and resins for DLP);
- Use of distinct 3D-printing instruments (e.g., 3D printers and 3D pens).
Dr. Rodrigo Amorim Bezerra Da Silva
Dr. Bruno Gabriel Lucca
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- three-dimensional (3D) printing
- additive manufacturing technology
- Fusion Deposition Modeling (FDM)
- Digital Light Processing/DLP
- 3D printer
- 3D pen
- 3D-printed electrochemical sensors
- 3D-printed electrochemical devices
- conductive filaments
