Thin Film Technology: From Fundamentals to Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 30 June 2024 | Viewed by 78
Special Issue Editor
Special Issue Information
Dear Colleagues,
The downward scaling of system dimensions in future electronic devices and the prevalent heterogeneous integration of variable surfaces bring tremendous challenges to scientists and engineers. This Special Issue on thin film technologies in electronic devices addresses various challenges towards emerging applications. Innovation of and advances in thin film technologies are crucial for the development of a wide variety of fields and should thus be of high interest. We would like to invite you to contribute your latest original studies on thin film technologies. Topics of interest for this Special Issue include, but are not limited to, the following:
- Thin film deposition and optimization;
- Eco-friendly fabrication and evaluation towards sustainable practices, such as reusing, recycling, reducing waste production, reducing energy consumption, and so on;
- Material engineering to improve and modulate device performances, through doping, post-annealing, radiation, etc.;
- Thin film integration into electronic devices, such as advanced memory, advanced logic, sensors, MEMS, devices for RF, 5G/6G, THz and mm-wave, computing, advanced power devices, energy storage, flexible devices, and so on;
- Novel material design and engineering with structural and functional enhancements;
- Simulation and modeling;
- Surfaces and interfaces in multilayered structures;
- Robustness and reliability of thin films, including harsh environments, mechanical/thermal/electromagnetic/radiation stresses, and effects.
Dr. Minghua Li
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thin film growth and processing
- thin film characterization
- surface and interface
- micro/nanostructure
- heterogeneous integration
- robustness and reliability
- thin film-based microelectronic devices
