Emerging Smart Materials for Microelectromechanical Systems

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 30 June 2024 | Viewed by 143

Special Issue Editor

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Guest Editor
Nanoscience and Microsystems Engineering and Mechanical Engineering, University of New Mexico, Albuquerque, NM 87106, USA
Interests: piezoelectrics; energy harvesting; acoustic resonators; flexible/stretchable electronics; stimuli responsive polymers
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Special Issue Information

Dear Colleagues,

The development of functional and multifunctional materials for the application of microelectromechanical systems (MEMS) is needed to enhance performance and create new transduction mechanisms for sensors and actuators. Enhancing material properties and developing methods of integrating and fabricating materials is the cornerstone to developing new MEMS devices. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on the development of emerging functional and multifunctional materials for MEMS devices. This includes, but is not limited to, the development of new materials, enhancing material properties, developing new transduction mechanisms for materials, the integration of materials, new deposition techniques, or increasing manufacturing compatibility with MEMS. The Special Issue is interested in all types of functional materials, including 2D and thin films.

Dr. Nathan Jackson
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • smart materials
  • multifunctional materials
  • thin films
  • MEMS

Published Papers

This special issue is now open for submission.
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