Advanced Packaging for Microsystem Applications, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 76

Special Issue Editors


E-Mail Website
Guest Editor
School of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, China
Interests: MEMS technology; electronic packaging and microassembly technology
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, China
Interests: MEMS technology; electronic packaging and microassembly technology; smart materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In line with the fast-moving trends of microelectronic technology, recent years have seen the optimization of microsystems and their different electronic components towards reduced size, high performance, high frequency, and high reliability. However, significant challenges have arisen in the application of advanced packaging materials and techniques in MEMS/NEMS. For example, complex operating environments can significantly affect mechanical and electrical properties, greatly influencing the reliability of these devices and systems. Consequently, the physical properties, design, and preparation of novel packaging materials and techniques need further study to optimize micro-/nanodevices. The design and manufacturing process can directly affect the reliability, cost, and performance of these products. However, the modeling and simulation of electronic packaging, in lieu of experimentation, can overcome many of these problems.

Accordingly, this Special Issue seeks to showcase research papers and review articles that focus on advanced packaging, materials, microsystems, the reliability of devices and systems, and micro-/nanodevices. Topics of interest might include, but are not limited to, the following:

  • Advanced packaging technology;
  • The reliability of devices and systems;
  • Advanced packaging materials;
  • MEMS/NEMS;
  • Microsystems.

Prof. Dr. Wenchao Tian
Dr. Yongkun Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced packaging technology
  • MEMS
  • reliability
  • NEMS
  • packaging materials
  • modeling and simulation
  • design and manufacturing process
  • microsystems

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Published Papers

This special issue is now open for submission.
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