Image Sensors and Companion Chips

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microelectronics".

Deadline for manuscript submissions: 20 August 2024 | Viewed by 103

Special Issue Editor


E-Mail Website
Guest Editor
School of Microelectronics, Tianjin University, Tianjin 300072, China
Interests: CMOS image sensors; mixed-signal integrated circuits

Special Issue Information

Dear Colleagues,

CMOS image sensors are highly integrated optoelectronic chips which convert optical information into digital information that is easy to process and store. Due to the rapid development of CMOS technologies, the performance of CMOS image sensors has been greatly improved, and the functionality of CMOS image sensors has also diversified. Nowadays, CMOS image sensors undergo a widespread application in various field, such as mobile devices, consumer electronics, AR/VR devices, automotive electronics, security monitoring, medical imaging, industrial imaging, spacing imaging, scientific observation, and so on. To form an imaging system, CMOS image sensors are usually companied with some other chips, such as image signal processor, digital signal processor, interface circuit chips, etc. With the development of 3D integration and packaging technology, multiple chips can be integrated into one chip to form more compact imaging systems.

This Special Issue encourages researchers to present their theories, techniques, circuits, and systems of CMOS chips for image sensing and companion chips. The scope of this Special Issue focuses on, but is not limited to:

  • CMOS image sensor modeling;
  • High-performance active pixels;
  • Low-noise readout circuits;
  • High-speed imaging techniques;
  • Dynamic range extension technology;
  • Low-light imaging;
  • High-resolution imaging;
  • 3D imaging;
  • Dynamic vision sensors;
  • Spike-based image sensors;
  • Sensory and computational integration;
  • Image signal processing;
  • Single photon counting technique;
  • Image sensor interfaces.

Dr. Kaiming Nie
Guest Editor

Manuscript Submission Information

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Keywords

  • CMOS image sensor
  • pixels
  • readout circuits
  • low-light imaging
  • high dynamic range
  • high-speed imaging
  • 3D imaging
  • DVS
  • ISP
  • SPAD

Published Papers

This special issue is now open for submission.
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