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Electronics
Special Issues
Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems
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Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 15 June 2024 | Viewed by 1873

Special Issue Editors

Dr. Ya Fei Wu

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: antennas; RF microsystems
Dr. Ji-Wei Lian

E-Mail Website
Guest Editor
School of Microelectronics, Nanjing University of Science and Technology, Nanjing 210094, China
Interests: millimeter-wave antenna; metasurface antenna; feeding network
Dr. Yujie Zhang

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117576, Singapore
Interests: antenna design on the Internet-of-Things applications; reconfigurable intelligent antenna and surface; MIMO systems; millimeter wave; RF energy harvesting; wireless power transmission and 6G
Dr. Zijian Shao

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ 08540, USA
Interests: antennas; integrated electronics; RFICs

Special Issue Information

Dear Colleagues,

With continuously evolving wireless communication technologies and the imminent arrival of Next-G networks, innovative solutions to antennas, circuits, and systems are needed. This Special Issue of Electronics seeks to amalgamate state-of-the-art research and developments in the field of advanced wireless technologies, thereby facilitating the imminent generation of wireless communication systems. The compendium aspires to not only showcase the vanguard of current technological advancements, but also to instigate discourse on the potential future directions, ensuring a comprehensive understanding and readiness for the challenges and opportunities presented by Next-G networks.

This Special Issue aims to provide a platform for researchers, engineers, and academics to share their latest findings and insights into antennas, circuits, and systems designed for Next-G  networks. The topics of interest include, but are not limited to:

  • Advanced antenna design and optimization for 5G and beyond.
  • Millimeter-wave and terahertz antennas for high-speed data transmission.
  • Novel circuit designs for efficient and high-performance wireless communication.
  • The integration of RF and microwave circuits with advanced signal processing techniques.
  • MIMO and beamforming technologies for enhanced network capacity.
  • Energy-efficient wireless systems and power management.
  • Antenna and circuit solutions for emerging applications such as IoT, smart cities, and autonomous vehicles.
  • Security and privacy considerations in Next-G network technologies.

Dr. Ya Fei Wu
Dr. Ji-Wei Lian
Dr. Yujie Zhang
Dr. Zijian Shao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • antenna design and optimization
  • millimeter-wave and terahertz antennas
  • circuit designs
  • integration of RF system
  • MIMO and beamforming technologies
  • wireless systems
  • next-G network technologies

Published Papers (2 papers)

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Research

15 pages, 4907 KiB  
Article
Design of UWB Electrically Small Antenna Based on Distributed Passive Network Loading
by Zhe Chen, Xianqi Lin, Yuchen Luan, Xinjie Hao, Xiaoming Yan and Guo Liu
Electronics 2024, 13(5), 914; https://doi.org/10.3390/electronics13050914 - 28 Feb 2024
Viewed by 610
Abstract
In this paper, an ultra-wideband electrically small antenna based on distributed passive network loading is proposed. Based on the Vivaldi antenna theory, magnetic dipole antenna theory, and distributed loading theory, the electrically small antenna achieves the purpose of being wideband using a three-dimensional [...] Read more.
In this paper, an ultra-wideband electrically small antenna based on distributed passive network loading is proposed. Based on the Vivaldi antenna theory, magnetic dipole antenna theory, and distributed loading theory, the electrically small antenna achieves the purpose of being wideband using a three-dimensional design of a planar Vivaldi antenna structure under limited space constraints. At the same time, the magnetic dipole antenna is introduced to effectively expand the low-frequency bandwidth of the electrically small antenna without increasing the aperture size. Finally, through the distributed passive network loading, the wideband-conjugated matching of the electrically small antenna is achieved without increasing the size of the electrically small antenna. The −6 dB bandwidth of the electrically small antenna is 0.2 GHz–3 GHz, and the overall size is 0.06 λ0 × 0.05 λ0 × 0.12 λ0, where λ0 is the wavelength of the lowest frequency of the antenna. One sample of the proposed UWB electrically small antenna is fabricated and tested. Good agreement between simulation results and measurement results are obtained. The design method of UWB electrically small antenna proposed in this paper can be applied to the base station antenna, low-frequency detection, microwave sensing, and microwave measurement. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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12 pages, 4621 KiB  
Article
Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
by Yuhang Yin, Chenhui Xia, Shuli Liu, Zhimo Zhang, Chen Chen, Gang Wang, Chenqian Wang and Yafei Wu
Electronics 2024, 13(5), 839; https://doi.org/10.3390/electronics13050839 - 22 Feb 2024
Viewed by 690
Abstract
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while [...] Read more.
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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