New Advances in Optical Imaging and Metrology
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Optoelectronics".
Deadline for manuscript submissions: 16 December 2024 | Viewed by 502
Special Issue Editors
Interests: optical metrology; 3d shape measurement; 3D deformation measurement
Special Issue Information
Dear Colleagues,
Optical imaging and metrology are rapidly developing fields with numerous applications in various domains, including medicine, biology, engineering, and physics. Recently, this field has been making great progress with prevalence of computational optical imaging and metrology. The development tendency of computational imaging and metrology is towards higher resolution and accuracy, faster processing speed, and more sophisticated algorithms for data analysis and interpretation. One key of this trend is the increasing demand for accurate and efficient measurement and imaging techniques for a wide range of applications. Another important trend is the integration of optics with other technologies, such as artificial intelligence (AI), to enable more advanced data processing and analysis. All these developments enable new applications and capabilities that were previously not possible, and will continue to drive innovation in this exciting field.
This special issue aims to highlight recent advances in the development and application of optical imaging and metrology techniques, with particular emphasis on novel approaches, breakthroughs, and emerging applications.
The topics of interest for this special issue include, but are not limited to:
- Three-dimensional shape and deformation measurement.
- Strain analysis.
- Novel approaches in optical metrology, including fringe projection profilometry, digital image correlation and phase measuring deflectometry.
- Emerging applications of optical techniques in industry, manufacturing, and quality control.
- Computational multispectral imaging
- Novel approaches in computer vision, computaional imaging, deep-learning-based image processing
Dr. Zhoujie Wu
Dr. Junfei Shen
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- optical metrology
- 3D shape measurement
- 3D deformation measurement
- strain snslysis
- computaional imgaing
- multispectral imaging
