Advancement in Additive Manufacturing and Signal Interference Detection in Communication Network

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 62

Special Issue Editors


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Guest Editor
School of Engineering, Faculty of Science and Engineering, Macquarie University, Sydney, NSW 2109, Australia
Interests: 3D printed antenna; satellite communication; microwave communication; antenna design
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Guest Editor
Department of Information and Communication Engineering, Gwangju 61452, Republic of Korea
Interests: metasurface design; mmWave antennas; rain attenuation; antenna design and wave propagation
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
School of Electrical & Data Engineering, University of Technology Sydney, Sydney, NSW 2007, Australia
Interests: antenna design and wave propagation; microwave and millimeter wave communication; engineering electromagnetics; metasurface
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The advancement in communication media are increasing in recent scenario with progress in additive manufacturing and error detection in commuication path. Error detection has been growing concern in defined communication media where the effect can be due to rain especially in higher frequency of operation, signal interference resulted due to unwanted carriers such as Network Termination Devices in satellite and microwave field. In this special issue, we are focusing on the development of novel three dimensional (3D) printed surface along with applicable signal tracing especially focusing on the inference level.  

The topics of interests include but not limited to:

  • Advancement in 5G/B5G/6G technologies;
  • Network Termination Devices management and signal intensity level;
  • Satellite communication path and signal tracing in slant path;
  • Utilization of 3D printed surfaces to detect the error margin;
  • Characterization of novel materials;
  • Use of filaments, resin to realize the complex geometrical surfaces;
  • Ulization of metal 3D printing technologies;
  • Artificial intelligence and use of Neural Network in communication design scenarios;
  • Spectrum Analyzer to detect the interferance level;
  • Use of time division technology for defined time slot;
  • 3D printed beam steerable surface design;
  • Complex array configurable antenna sources;
  • Novel concept for patch design and resonant cavity antenna;
  • Use of copper painted solution on 3D printed antenna surfaces;
  • Ralization of 3D printed sources and its effect on sattellite and microwave communication.

Dr. Sujan Shrestha
Dr. Dong-You Choi
Prof. Dr. Karu P. Esselle
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advancement in 5G/B5G/6G technologies
  • network termination devices management and signal intensity level
  • satellite communication path and signal tracing in slant path
  • utilization of 3D printed surfaces to detect the error margin
  • characterization of novel materials
  • use of filaments, resin to realize the complex geometrical surfaces
  • ulization of metal 3D printing technologies
  • artificial intelligence and use of Neural Network in communication design scenarios.
  • spectrum analyzer to detect the interferance level
  • use of time division technology for defined time slot
  • 3D printed beam steerable surface design
  • complex array configurable antenna sources
  • novel concept for patch design and resonant cavity antenna
  • use of copper painted solution on 3D printed antenna surfaces
  • ralization of 3D printed sources and its effect on sattellite and microwave communication

Published Papers

This special issue is now open for submission.
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