Microelectromechanical Systems (MEMSs): Design, Fabrication, Integration, and Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microelectronics".
Deadline for manuscript submissions: 15 May 2024 | Viewed by 138
Special Issue Editors
Interests: microelectromechanical systems; microsystems; RF MEMS
Interests: metamaterials and metasurfaces; terahertz devices; microelectromechanical system; microsystems
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Microelectromechanical systems (MEMSs) represent a groundbreaking domain in the world of miniaturized devices, renowned for their ability to seamlessly integrate mechanical, electrical, and optical components at a microscale. MEMSs play a pivotal role in enabling miniaturized high-performance sensors and actuators, and are instrumental in driving forward the ongoing intelligence revolution, where interconnected and intelligent systems and IoT applications rely on MEMS devices for data acquisition, processing, and control. Recent developments in the design methodology, fabrication, and integration techniques advance MEMSs toward intelligent microsystems.
This Special Issue will be focused on the design, fabrication, and integration technology for enabling novel MEMS devices and applications in various electronic systems. In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:
- The system-level modelling of MEMSs;
- The multiphysics simulation of MEMSs;
- Advanced materials in MEMSs;
- Novel fabrication and integration techniques for MEMSs;
- The design and implementaion of electronic circuits for MEMSs;
- Artificial intelligence and MEMSs;
- Novel applications of MEMSs.
Dr. Jiahao Zhao
Dr. Xiaoguang Zhao
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microelectromechanical systems (MEMS)
- sensors, actuators
- microsystems
- integrated circuits
- novel materials
- design and simulation
- micro/nano fabrication
- integration
