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Journal: Electronics, 2022
Volume: 11
Number: 1021

Article: A Fault Detection Method of IGBT Bond Wire Fatigue Based on the Reduction of Measured Heatsink Thermal Resistance
Authors: by Dan Luo, Minyou Chen, Wei Lai, Hongjian Xia, Zhenyu Deng, Zhi Wang and Kai Yu
Link: https://www.mdpi.com/2079-9292/11/7/1021

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