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Journal: Electronics, 2022
Volume: 11
Number: 221

Article: Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model
Authors: by Xiaoting Luo, Zhiheng Huang, Shuanjin Wang, Min Xiao, Yuezhong Meng, Hui Yan, Qizhuo Li and Gang Wang
Link: https://www.mdpi.com/2079-9292/11/2/221

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