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Journal: Polymers, 2021
Volume: 13
Number: 1721

Article: Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications
Authors: by Mario Mora, Hippolyte Amaveda, Luis Porta-Velilla, Germán F. de la Fuente, Elena Martínez and Luis A. Angurel
Link: https://www.mdpi.com/2073-4360/13/11/1721

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