Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave
Round 1
Reviewer 1 Report
Review of the paper "Dual sided thermal-stress splitting opaque brittle materials using thermal-controlled fracture method by microwave".
The method of thermally controlled destruction of brittle materials proposed by the authors is very promising and environmentally friendly. This clearly shows the quality of the surface and the absence of dust when cutting.
The material of the article is presented logically, all methods are beautifully illustrated, the results are explained, models are created, confirmed by experiments.
I enjoyed this work.
I believe that the work can be published in the form presented.
Reviewer 2 Report
The authors present a nice and interesting work describing a new method for cutting opaque brittle materials by double side microwave-assisted heating source. They have proven the feasibility and benefits over other methods experimentally and understand the underlying mechanisms by modelling the heat transfer and stress development in each case. They also investigated the limits in thickness and the precision and surface roughness of the split ceramic sheet depending on thickness and process parameters. The manuscript is well written and structured and thus is easy to follow. Hence, I recommend accepting it in its current form.
