Millimeter-Wave/Terahertz Integrated Circuit Design

Dear Colleagues,

In the past two decades, an abundance of mobile services has continued to emerge, stretching from traditional telecommunications services and internet services to new communication application scenarios such as the Internet of Things and cloud computing. The world has entered an era where everything and everyone needs to be interconnected. Wireless interconnectivity is now a strong need. Currently, communication channels are becoming increasingly crowded, making a shift to millimeter-wave (mm-wave) and terahertz (THz) bands inevitable to release a greater bandwidth. Both of these bands have enormous potential, not only in terms of communication but also in radar sensing, imaging, radio astronomy, and atmospheric sensing.

Along with numerous opportunities in communication and other applications, the design of emerging mm-wave and THz electronic circuits and systems faces challenges. Since these frequency bands are getting close to the fmax of active devices, the available gain from the active devices declines rapidly at these frequencies. Transmission in these two frequency bands also faces greater challenges than transmission in low GHz radio frequency (RF) and microwave frequency bands. Hence, there is a strong need for investigation of the fundamentals and practicalities in mm-wave and THz integrated circuit design.

In this context, this Special Issue offers a premier interdisciplinary platform for researchers to disseminate their results in areas of mm-wave and THz integrated circuit design to a diverse audience in an open access format. To that end, we invite authors to submit their original and previously unpublished research papers and comprehensive reviews in the following or related topics of mm-wave and THz integrated circuit design and beyond:

• Integrated circuits for mm-wave and THz radar and communications.
• Integrated circuits for mm-wave and THz sensing and imaging.
• Novel integrated circuit design for mm-wave and THz applications.
• Mm-wave and THz transceiver array.
• On-chip mm-wave and THz antenna.
• Oscillators and frequency synthesizers.
• Heterogeneous integration of CMOS and compound semiconductor circuits.
• Integrated mm-wave and THz radar sensors.
• Chip packaging for mm-wave and THz band
• Modeling for mm-wave and THz circuit and device.

Dr. Ruibing Dong
Dr. Yang Xing
Dr. Ramesh Pokharel
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• mm-wave
• THz
• integrated circuit design
• RF frontend
• radar
• sensors
• CMOS
• III-V compound semiconductor