Printed Electronics: Shaping the Future of Sensors with New Design and Fabrication Methods
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Flexible Electronics".
Deadline for manuscript submissions: 16 December 2024 | Viewed by 233
Special Issue Editors
Interests: printed electronics; flexible electronics; sensor design; embedded electronics; sEMG
Interests: printed electronics; flexible devices; microsystems; MEMs; sensors; embedded systems; microfluidics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Recent advances in printed and flexible electronics are highlighting their ever-growing potential; modern material stacks (substrates and ink formulations) have paved the way for sensing in various demanding and sensitive frameworks. Micromachining–microfabrication, with the involvement of printing technologies, allows the design of new generations of sensors which were previously impossible to be fabricated. One the one hand, large-scale and high-speed mass production can be achieved with printing techniques, thus contributing to the development of very low-cost, disposable sensors. On the other hand, combining new materials such as carbon nanocomposites, conductive polymers, insulators, and doped semiconductive inks with biocompatible, ceramic, plastic, and paper substrates can cover a wide area of applications.
This Special Issue aims to collect recent research on printed electronics with emphasis on innovative devices. Original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:
- Physical, chemical, optical, and mechanical sensors;
- Printed tags for security applications—physical unclonable functions;
- Biodegradable, implantable sensors and electrodes for biosensing;
- 2.5D/3D printed sensors;
- Micro-nano patterning techniques for printed sensors;
- Hybrid systems (combination of traditional and printed electronics);
- Design for manufacturing printed electronics;
- Electrical contact and material interfaces.
We look forward to receiving your contributions.
Dr. Dimitris Barmpakos
Prof. Dr. Grigoris Kaltsas
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible sensors and devices
- printed sensors and devices
- hybrid sensors and devices
- micropatterned printed devices
- security tags
- printed unclonable functions
- wearable sensors
