Advanced Materials for Thermal Management of Electronics

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 16 August 2024 | Viewed by 1135

Special Issue Editors


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Guest Editor
Mechanical Engineering Department, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia
Interests: thermal sciences and heat transfer with a focus on electronics cooling; condensation; nanofluids; heat transfer devices; thermal management
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Department of Engineering, School of Physics, Engineering and Computer Science, Hertfordshire AL10 9AB, UK
Interests: energy system and renewable energy technologies; energy-efficient and sustainable technology; heat transfer and heat exchangers; waste heat recovery and thermal management; industrial modelling, simulation, optimization, and control
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
School of Engineering, Edith Cowan University, Joondalup 6027, Australia
Interests: solar energy applications; low-grade waste heat recovery and applications; artificial intelligence in energy systems; multi-phase flows; environmental fluid mechanics

Special Issue Information

Dear Colleagues,

With advances in manufacturing technologies, it is now possible to produce electronics that are more compact and able to provide faster processing with increased computing capabilities. However, this increase in computing power has also increased the contemporary heat generation through such components. Therefore, it is now of the utmost important to come up with more advanced cooling systems for electronics. With current advances in materials sciences, we now have more advanced materials, such as nanomaterials and phase-change materials, etc., that can be used with optimized heat sinks to provide more effective thermal regulation for electronic components. There are, however, several challenges in commercializing these materials and mitigating their limiting factors, such as thermal conductivity in the case of phase-change materials and other problems with nanofluids. Therefore, this Special Issue will consider advances in such technologies, specifically focused on advanced-materials-based thermal management. Manuscripts for this Special Issue are welcome in the form of review articles, research papers, or short technical notes.

We invite recent experimental, numerical and theoretical developments in the field of advanced-materials-based thermal management of electronics. The research topics may include, but are not limited to, the following:

  • Phase-change materials for electronics thermal management systems
  • Porous media for thermal management
  • Thermal management of photovoltaics
  • Nanofluids-based thermal management systems
  • Active and passive thermal management
  • Utilization of nanotechnology for miniature heat sinks
  • Micro-channels for thermal management
  • Convection heat transfer for thermal management
  • Efficiency improvement for thermal management
  • Artificial intelligence-based models for optimization
  • Numerical advances on thermal management systems

Dr. Hafiz Muhammad Ali
Dr. Hongwei Wu
Dr. Mehdi Khiadani
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electronics thermal management systems
  • photovoltaics
  • thermal management

Published Papers

This special issue is now open for submission.
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