Next Article in Journal
How Far Down? Interdisciplinary Discussions and Multimodal Investigations to Understand the Potential of Multispectral Remote Sensing
Previous Article in Journal
A Phenylalanine Ammonia Lyase Capacitive Sensor for Phenylalanine Detection
 
 
Font Type:
Arial Georgia Verdana
Font Size:
Aa Aa Aa
Line Spacing:
Column Width:
Background:
Abstract

Additive Manufacturing Electronics for Packaging High-Frequency Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducer Probes †

by
Vincenzo Mariano Mastronardi
1,2,*,
Antonio Qualtieri
2,
Enrico Boni
3,
Piero Tortoli
3,
Roberto De Fazio
1,
Paolo Visconti
1,2,
Maria Teresa Todaro
2,4 and
Massimo De Vittorio
1,2
1
Department of Innovation Engineering, University of Salento, 73100 Lecce, Italy
2
Center for Biomolecular Nanotechnologies, Istituto Italiano di Tecnologia, 73010 Arnesano, Italy
3
Dipartimento di Ingegneria dell’Informazione, University of Florence, 50139 Florence, Italy
4
Institute of Nanotechnology, National Research Council, 73100 Lecce, Italy
*
Author to whom correspondence should be addressed.
Presented at the XXXV EUROSENSORS Conference, Lecce, Italy, 10–13 September 2023.
Proceedings 2024, 97(1), 52; https://doi.org/10.3390/proceedings2024097052
Published: 18 March 2024

Abstract

:
Additive Manufacturing Electronics (AME) is a promising method that has the potential to directly embed piezoelectric micromachined ultrasonic transducer (PMUT) probes into conventional electronic circuits and boards. It enables fast customized prototyping, three-dimensional circuit boards, and small-series production. In this study, annular probes composed of circular suspended Aluminum Nitride (AlN)-based PMUT membranes, addressed in 2-dimensional arrays, were designed, fabricated, and encapsulated using AME technology.

1. Introduction

Medical imaging applications frequently involve scanning human body tissues using high-frequency ultrasonic transducers (2–15 MHz). Micromachined ultrasonic transducers (MUTs) have replaced traditional piezo-ceramic devices [1] in high-resolution imaging because of their small size, the low cost during production, and integration with conventional circuitry and CMOS technology. They enable a higher level of sensing capability and allow an overall decrease in device dimensions, thus becoming extremely attractive for mass manufacturing. Flexural membranes with circular, annular, or dome shapes can be used to develop MUTs, which can be activated using various transduction methods. Among them, capacitive (CMUT) [2,3] and piezoelectric (PMUT) [4,5,6,7] arrays have been extensively studied. In particular, PMUT probes have evolved significantly in recent years due to the substantial improvements in piezoelectric thin-film technology and miniaturization. The main advantages of PMUTs include higher sensitivity, faster response times, and greater design flexibility. Nevertheless, encapsulating small-size PMUTs is still subject to several constraints. In this regard, Additive Manufacturing Electronics (AME) is a promising method that has the potential to directly combine PMUTs into conventional electronic circuits [8,9,10,11,12,13]. It would enable fast customized prototyping, three-dimensional circuit boards, and small-series production.

2. Materials and Methods

In this study, annular 2D arrays composed of circular suspended Aluminum Nitride (AlN)-based PMUT membranes were designed and fabricated. Silicon was used as the structural substrate. The thickness of the suspended membranes (tm = 25 µm, including the AlN film and structural silicon) and their radii (rm = 100 µm) were accurately engineered to operate at a central frequency of 6 MHz (Figure 1). The AlN-based disks (1µm thick), embedded between two molybdenum electrodes (300 nm thick), were organized in annular arrays (as shown in Figure 1a). The final size of the probe was 6 mm, including up to 72 micro-membranes.
The PMUT arrays were directly packaged and electrically connected using AME technology. The packaging was printed using Nano Dimension’s DragonFly IV® system, whose manufacturing protocol was adequately optimized. AME technology enabled automated probe alignment with a very thin packaging board (500 µm thick) and a direct electrical connection to signal PADs, preventing standard wire bonding (Figure 1b(i)).

3. Results and Discussion

A pulser/receiver and a commercial immersion transducer (1 MHz bandwidth and 5 MHz nominal frequency) were used to analyze the transmitted ultrasound. Negative driving pulses (400 V amplitude, 1 kHz repetition frequency, 30 ns pulse duration) were used to drive each ring separately, while the probe, entirely isolated by a parylene C covering, was immersed in liquid. Figure 1b(ii) shows the emitted signals at a distance of 1 cm from each ring of the annular array (the upper and lower envelopes—red and green traces, respectively—are also reported).
These preliminary results show that the integration of high-frequency PMUT probes and miniaturized architecture using additive manufacturing technology is a promising approach to develop advanced sensors for various ultrasound applications.

Author Contributions

Conceptualization, V.M.M., E.B., P.T. and M.D.V.; Methodology, V.M.M., A.Q. and M.T.T.; Investigation, V.M.M., R.D.F. and P.V.; Writing—original draft preparation, V.M.M.; Supervision, M.D.V. All authors have read and agreed to the published version of the manuscript.

Funding

This work was carried out within the framework of the project “RAISE-Robotics and AI for Socio-economic Empowerment”, ECS00000035 and has been supported by European Union-NextGenerationEU PNRR MUR-M4C2–I1.5-Avviso “Ecosistemi dell’Innovazione”. However, the views and opinions expressed are those of the authors alone and do not necessarily reflect those of the European Union or the European Commission. Neither the European Union nor the European Commission can be held responsible for them.

Conflicts of Interest

The authors declare no conflicts of interest.

References

  1. Atheeth, S.; Krishnan, K.; Arora, M. Review of pMUTs for medical imaging: Towards high frequency arrays. Biomed. Phys. Eng. Express 2023, 9, 022001. [Google Scholar]
  2. Brenner, K.; Ergun, A.S.; Firouzi, K.; Rasmussen, M.F.; Stedman, Q.; Khuri–Yakub, B. Advances in Capacitive Micromachined Ultrasonic Transducers. Micromachines 2019, 10, 152. [Google Scholar] [CrossRef] [PubMed]
  3. Gerardo, C.D.; Cretu, E.; Rohling, R. Fabrication and testing of polymer-based capacitive micromachined ultrasound transducers for medical imaging. Microsyst. Nanoeng. 2018, 4, 19. [Google Scholar] [CrossRef] [PubMed]
  4. Pala, S.; Lin, L. Piezoelectric Micromachined Ultrasonic Transducers (pMUT) with Free Boundary. In Proceedings of the 2020 IEEE International Ultrasonics Symposium (IUS), Las Vegas, NV, USA, 7–11 September 2020; pp. 1–4. [Google Scholar]
  5. Qiu, Y.; Gigliotti, J.V.; Wallace, M.; Griggio, F.; Demore, C.E.M.; Cochran, S.; Trolier-McKinstry, S. Piezoelectric Micromachined Ultrasound Transducer (PMUT) Arrays for Integrated Sensing, Actuation and Imaging. Sensors 2015, 15, 8020–8041. [Google Scholar] [CrossRef] [PubMed]
  6. Liu, T.; Dangi, A.; Kim, J.N.; Kothapalli, S.-R.; Choi, K.; Trolier-McKinstry, S.; Jackson, T. Flexible Thin-Film PZT Ultrasonic Transducers on Polyimide Substrates. Sensors 2021, 21, 1014. [Google Scholar] [CrossRef] [PubMed]
  7. Savoia, A.S.; Casavola, M.; Boni, E.; Ferrera, M.; Prelini, C.; Tortoli, P.; Giusti, D.; Quaglia, F. Design, Fabrication, Characterization, and System Integration of a 1-D PMUT Array for Medical Ultrasound Imaging. In Proceedings of the 2021 IEEE International Ultrasonics Symposium (IUS), Xi’an, China, 11–16 September 2021; pp. 1–3. [Google Scholar]
  8. Mastronardi, V.M.; Guido, F.; Amato, M.; De Vittorio, M.; Petroni, S. Piezoelectric ultrasonic transducer based on flexible AlN. Microelectron. Eng. 2014, 121, 59–63. [Google Scholar] [CrossRef]
  9. Hemmelgarn, F.; Ehlert, P.; Mager, T.; Jürgenhake, C.; Dumitrescu, R.; Springer, A. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. In Proceedings of the 2021 14th International Congress Molded Interconnect Devices (MID), Amberg, Germany, 8–11 February 2021; pp. 1–8. [Google Scholar]
  10. Aspar, G.; Goubault, B.; Lebaigue, Q.; Souriau, C.; Simon, G.; Di Cioccio, L.; Brechet, Y. 3D Printing as a New Packaging Approach for MEMS and Electronic Devices. In Proceedings of the 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 30 May–2 June 2017; pp. 1071–1079. [Google Scholar]
  11. Schmidt, K.; Polzinger, B.; Runtze, M.; Zimmermann, A. Embedding and Contacting of Electrical Components for Hybrid Additive Manufacturing. IEEE Trans. Compon. Packag. Manuf. Technol. 2022, 12, 1401–1409. [Google Scholar] [CrossRef]
  12. Zhang, Z.; Yuan, X. Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters. IEEE J. Emerg. Sel. Top. Power Electron. 2022, 10, 4509–4525. [Google Scholar] [CrossRef]
  13. Varzaru, G.; Savu, M.; Mihailescu, B.; Ionescu, C.; Branzei, M. Contributions to an additive method for manufacturing solderless assembly for electronics. J. Phys. Conf. Ser. 2022, 2339, 012029. [Google Scholar] [CrossRef]
Figure 1. (a) Annular probe with AlN membranes arranged along five circular rings; (b) 3D design of package with final probe encapsulation and transmission measurement in time domain for 1st resonance mode in liquid (Ring 1 is the outer and most populated ring, and Ring 5 is the inner and less populated one).
Figure 1. (a) Annular probe with AlN membranes arranged along five circular rings; (b) 3D design of package with final probe encapsulation and transmission measurement in time domain for 1st resonance mode in liquid (Ring 1 is the outer and most populated ring, and Ring 5 is the inner and less populated one).
Proceedings 97 00052 g001
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.

Share and Cite

MDPI and ACS Style

Mastronardi, V.M.; Qualtieri, A.; Boni, E.; Tortoli, P.; De Fazio, R.; Visconti, P.; Todaro, M.T.; De Vittorio, M. Additive Manufacturing Electronics for Packaging High-Frequency Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducer Probes. Proceedings 2024, 97, 52. https://doi.org/10.3390/proceedings2024097052

AMA Style

Mastronardi VM, Qualtieri A, Boni E, Tortoli P, De Fazio R, Visconti P, Todaro MT, De Vittorio M. Additive Manufacturing Electronics for Packaging High-Frequency Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducer Probes. Proceedings. 2024; 97(1):52. https://doi.org/10.3390/proceedings2024097052

Chicago/Turabian Style

Mastronardi, Vincenzo Mariano, Antonio Qualtieri, Enrico Boni, Piero Tortoli, Roberto De Fazio, Paolo Visconti, Maria Teresa Todaro, and Massimo De Vittorio. 2024. "Additive Manufacturing Electronics for Packaging High-Frequency Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducer Probes" Proceedings 97, no. 1: 52. https://doi.org/10.3390/proceedings2024097052

Article Metrics

Back to TopTop