Next Article in Journal
Two-Dimensional (2D) Slices Encryption-Based Security Solution for Three-Dimensional (3D) Printing Industry
Next Article in Special Issue
A Survey on Formal Verification Techniques for Safety-Critical Systems-on-Chip
Previous Article in Journal
Implementation of a Single-Phase SST for the Interface between a 13.2 kV MVAC Network and a 750 V Bipolar DC Distribution
Previous Article in Special Issue
Integrated Circuit Conception: A Wire Optimization Technic Reducing Interconnection Delay in Advanced Technology Nodes
 
 
Article

Article Versions Notes

Electronics 2018, 7(5), 63; https://doi.org/10.3390/electronics7050063
Action Date Notes Link
article xml file uploaded 4 May 2018 12:30 CEST Original file -
article xml uploaded. 4 May 2018 12:30 CEST Update -
article pdf uploaded. 4 May 2018 12:30 CEST Version of Record https://www.mdpi.com/2079-9292/7/5/63/pdf-vor
article html file updated 4 May 2018 13:18 CEST Original file -
article pdf uploaded. 8 May 2018 07:47 CEST Updated version of record https://www.mdpi.com/2079-9292/7/5/63/pdf
article xml uploaded. 8 May 2018 07:47 CEST Update -
article xml uploaded. 8 May 2018 07:47 CEST Update https://www.mdpi.com/2079-9292/7/5/63/xml
article html file updated 8 May 2018 07:49 CEST Update -
article html file updated 30 May 2018 11:30 CEST Update -
article html file updated 29 March 2019 21:49 CET Update -
article html file updated 16 April 2019 22:56 CEST Update -
article html file updated 30 April 2019 22:27 CEST Update -
article html file updated 3 October 2019 06:14 CEST Update -
article html file updated 9 February 2020 16:23 CET Update https://www.mdpi.com/2079-9292/7/5/63/html
Back to TopTop