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Journal: Appl. Sci., 2020
Volume: 10
Number: 8725

Article: Detecting and Measuring Defects in Wafer Die Using GAN and YOLOv3
Authors: by Ssu-Han Chen, Chih-Hsiang Kang and Der-Baau Perng
Link: https://www.mdpi.com/2076-3417/10/23/8725

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