Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Experimental Procedures
2.3. Organization and Property Test
3. Results
3.1. Microstructure of Solder Joint before Electromigration
3.2. Sn58Bi/Cu Solder Joint Temperatures for Different Joule Heating Properties
3.3. Electromigration Organization of Sn58Bi/Cu Solder Joints with Different Joule Heating Properties
3.4. Mechanical Properties of Sn58Bi/Cu Solder Joints with Different Joint Cross-Sectional Areas
4. Conclusions
- (1)
- With the increase in the cross-sectional area of Sn58Bi/Cu solder joints, the Joule heat and electromigration of joints increased, the anode IMC layer was thickened and transformed into a flat shape, and a Bi-rich layer was formed near the soldering zone, with its thickness gradually increasing. The cathode IMC layer first increased and then decreased and gradually dissolved; a Sn-rich zone was formed near the solder zone, and its thickness gradually increased; and microcracks were generated when the cross-sectional area of the joints was increased to 0.75 mm2.
- (2)
- With the increase in the cross-sectional area of Sn58Bi/Cu solder joints, microcracks gradually formed in the cathode area of the joints and gradually expanded. The fracture mechanism of the joint shear fracture changed from a mixed brittle/tough fracture, dominated by cleavage and secondary cracks, to a brittle fracture, dominated by cleavage; the fracture location shifted from the solder zone of the near-cathode IMC layer to the interfacial IMC layer; and the shear strength of the joint was reduced by 60.9% compared to that in the absence of electromigration.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Location | Sn | Bi | Cu |
---|---|---|---|
A | 0 | 100 | 0 |
B | 88.43 | 11.57 | 0 |
C | 40.64 | 0 | 59.36 |
D | 0 | 0 | 100 |
Location | Sn | Bi | Cu |
---|---|---|---|
C | 54.33 | 0.92 | 44.75 |
D | 91.13 | 6.30 | 2.57 |
Location | Sn | Bi | Cu |
---|---|---|---|
A | 67.45 | 31.75 | 0.80 |
B | 23.63 | 74.33 | 2.04 |
C | 52.56 | 39.02 | 8.42 |
D | 52.74 | 10.45 | 36.81 |
E | 58.23 | 31.38 | 10.39 |
F | 47.89 | 11.23 | 40.88 |
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Gao, Y.; Zhang, K.; Zhang, C.; Wang, Y.; Chen, W. Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties. Metals 2023, 13, 1475. https://doi.org/10.3390/met13081475
Gao Y, Zhang K, Zhang C, Wang Y, Chen W. Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties. Metals. 2023; 13(8):1475. https://doi.org/10.3390/met13081475
Chicago/Turabian StyleGao, Yijie, Keke Zhang, Chao Zhang, Yuming Wang, and Weiming Chen. 2023. "Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties" Metals 13, no. 8: 1475. https://doi.org/10.3390/met13081475