Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
Abstract
:1. Introduction
2. Material and Methods
3. Results and Discussion
4. Conclusions
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Addtives | Cu2+ Decrease Ratios (%) |
---|---|
P25 + ASP | 48 |
P25 | 0.010 |
ASP | 40 |
C16TAC | 2.5 |
Samples | BET Surface Area (m2/g) | BJH Pore Size (nm) | Pore Volume (cm3/g) |
---|---|---|---|
ASP | 36 | - | - |
P25 | 45 | - | - |
Cu–P25–ASP | 591 | 1.2 | 0.11 |
CSP | 806 | 1.2 | 0.18 |
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Machida, S.; Kato, R.; Hasegawa, K.; Gotoh, T.; Katsumata, K.-i.; Yasumori, A. Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions. Materials 2022, 15, 5132. https://doi.org/10.3390/ma15155132
Machida S, Kato R, Hasegawa K, Gotoh T, Katsumata K-i, Yasumori A. Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions. Materials. 2022; 15(15):5132. https://doi.org/10.3390/ma15155132
Chicago/Turabian StyleMachida, Shingo, Reo Kato, Kaishi Hasegawa, Takahiro Gotoh, Ken-ichi Katsumata, and Atsuo Yasumori. 2022. "Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions" Materials 15, no. 15: 5132. https://doi.org/10.3390/ma15155132