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Journal: Sensors, 2017
Volume: 17
Number: 1392

Article: Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis
Authors: by Kuo-Tsai Wu, Sheng-Jye Hwang and Huei-Huang Lee
Link: https://www.mdpi.com/1424-8220/17/6/1392

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