Integrated Circuit and Antenna Design for Millimeter-Wave and Terahertz Communication

A special issue of Telecom (ISSN 2673-4001).

Deadline for manuscript submissions: closed (30 November 2022) | Viewed by 4335

Special Issue Editors


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Guest Editor
1. Bachelor Program in Industrial Projects, National Yunlin University of Science and Technology, Yunlin, Taiwan
2. Department of Electronic Engineering, National Yunlin University of Science and Technology, Yunlin, Taiwan
Interests: MEMS sensing design; hardware/EE/RF circuit and IC design; antenna/microwave wireless design; EMC/EMI design; millimeter-wave and terahertz communication
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Guest Editor
College of Photonic and Electronic Engineering, Fujian Normal University, Fujian, China
Interests: photoelectric sensing; positioning; network communication
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Guest Editor
Department of Electronic Engineering, National Taiwan University of Sience and Technology, Taipei, Taiwan
Interests: advanced semiconductor devices; integrated circuits
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Guest Editor
School of Engineering Science of Applied Sciences, Simon Fraser University, Burnaby, BC, Canada
Interests: communication networks; nonlinear circuits and systems

Special Issue Information

Dear Colleagues,

With the worldwide rollout of the first commercial deployments of millimeter wave (mmWave) and satellite communication, the availability of wireless connectivity in integrated circuit and antenna design are closer to becoming a reality enabling several new use cases for millimeter wave and terahertz communication. The architecture will be deeply affected by this revolution, forcing both academic and commercial actors to partially redefine the hardware, both in terms of specifics and characteristics. Hence, there is a strong need for investigation of the fundamentals and practicalities in millimeter wave and terahertz communication from the perspectives of both academia and industry.

In this context, this Special Issue offers a premier interdisciplinary platform for researchers to disseminate their results in all areas of integrated circuit and antenna design to a diverse audience in an open access format. The present Special Issue is focused on presenting technical papers covering the various aspects of the front-end transceiver, ADC/DAC conversions, and the basic baseband functions, designed to address the new requirements at the system and circuit levels. This Special Issue focuses on the recent advances in THz wireless communications based either on electronics or photonics approaches, with an emphasis on THz passive and active components, THz devices and packaging, THz antennas and beam-steering techniques, modulation, and waveform design for THz channels. To that end, we invite authors to submit their original and previously unpublished research papers and comprehensive reviews in the following or related topics of millimeter wave (mmWave) and terahertz communication and beyond:

  • Transmitting and receiving millimeter-wave and terahertz communication;
  • Fusion millimeter-wave for edge computing and embedded IoT;
  • Integrated circuits for millimeter-wave applications;
  • RF frontend with antenna design for low Earth orbit satellites;
  • CMOS oscillators and frequency synthesizers, PLLs, sigma delta modulators;
  • Integrated radar sensors;
  • Wireless mmWave beamforming MIMO antennas;
  • Terahertz antennas and sensing;
  • Terahertz imaging and its applications;
  • Photoelectric sensing, network communication;
  • mmWave communication for vehicular networks;
  • Terahertz electronic components and devices.

Dr. Wen-Cheng Lai
Prof. Dr. Yi Wu
Prof. Dr. Sheng-Lyang Jang
Prof. Dr. Ljiljana Trajkovic
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Telecom is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • mmWave Communication
  • terahertz communication
  • wireless communications
  • antenna beamforming
  • integrated circuits

Published Papers (1 paper)

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Research

19 pages, 16263 KiB  
Article
Antenna-on-Chip for Millimeter Wave Applications Using CMOS Process Technology
by Ming-An Chung, Yu-Hsun Chen and Ing-Peng Meiy
Telecom 2023, 4(1), 146-164; https://doi.org/10.3390/telecom4010010 - 28 Feb 2023
Cited by 2 | Viewed by 2703
Abstract
In this paper, a monopole patch antenna is designed, and the structure of the antenna is analyzed. The manufacturing process adopts TSMC 0.18 μm CMOS process technology. An artificial magnetic conductor (AMC) on the M1 layer is proposed in this paper to increase [...] Read more.
In this paper, a monopole patch antenna is designed, and the structure of the antenna is analyzed. The manufacturing process adopts TSMC 0.18 μm CMOS process technology. An artificial magnetic conductor (AMC) on the M1 layer is proposed in this paper to increase the radiation gain and reduce the reflection coefficient (S11) magnitude for impedance matching and antenna performance. This method can make up for the radiation efficiency and benefits of the antenna-on-chip that are affected by the high dielectric constant and low resistivity of the silicon substrate of the CMOS process. The antenna designed in this paper obtains a simulated bandwidth of 37.5 GHz to 69.5 GHz using the Electromagnetic Simulation Software, and the fractional bandwidth of the design is 60%. Among them, 62 GHz shows a maximum gain value of −2.64 dBi. Actual measurements have confirmed that the reflection coefficient of the antenna on the chip proposed in this paper is the same as the simulation trend, and a wider bandwidth is obtained from 20.9 GHz to 67 GHz, with a fractional bandwidth of 104.89%. This bandwidth covers millimeter wave 28 GHz, 38 GHz, and 60 GHz application frequencies. Full article
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