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MEMS Sensors and Applications

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Optical Sensors".

Deadline for manuscript submissions: closed (29 February 2024) | Viewed by 5152

Special Issue Editor


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Guest Editor
Department of Electrical and Computer Engineering, University of West Florida, Pensacola, FL 32514, USA
Interests: electromechanical transducers; pressure sensors; motion and acceleration sensors; mems actuators
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The past two decades have witnessed substantial advances in MEMS (microelectromechanical systems) sensor technology. The emerging new field of nanotechnology and nanofabrication has allowed for the creation of a new array of MEMS sensors and transducers with remarkable properties. These MEMS sensors have seen dramatic improvements in characteristics, such as sensitivity and dynamic range, in addition to substantial miniaturization. This Special Issue invites contributions in all areas of MEMS sensors. Papers on pressure sensors, motion and acceleration sensors, microfluidic sensors, etc., are invited.

Prof. Dr. Ezzat Bakhoum
Guest Editor

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Keywords

  • MEMS sensors
  • nanotechnology
  • nanofabrication
  • sensitivity
  • dynamic range
  • pressure sensors
  • motion sensors
  • acceleration sensors
  • microfluidic sensors

Published Papers (3 papers)

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22 pages, 10952 KiB  
Article
Surface Acoustic Waves (SAW) Sensors: Tone-Burst Sensing for Lab-on-a-Chip Devices
by Debdyuti Mandal, Tally Bovender, Robert D. Geil and Sourav Banerjee
Sensors 2024, 24(2), 644; https://doi.org/10.3390/s24020644 - 19 Jan 2024
Viewed by 666
Abstract
The article presents the design concept of a surface acoustic wave (SAW)-based lab-on-a-chip sensor with multifrequency and multidirectional sensitivity. The conventional SAW sensors use delay lines that suffer from multiple signal losses such as insertion, reflection, transmission losses, etc. Most delay lines are [...] Read more.
The article presents the design concept of a surface acoustic wave (SAW)-based lab-on-a-chip sensor with multifrequency and multidirectional sensitivity. The conventional SAW sensors use delay lines that suffer from multiple signal losses such as insertion, reflection, transmission losses, etc. Most delay lines are designed to transmit and receive continuous signal at a fixed frequency. Thus, the delay lines are limited to only a few features, like frequency shift and change in wave velocity, during the signal analysis. These facts lead to limited sensitivity and a lack of opportunity to utilize the multi-directional variability of the sensing platform at different frequencies. Motivated by these facts, a guided wave sensing platform that utilizes simultaneous tone burst-based excitation in multiple directions is proposed in this article. The design incorporates a five-count tone burst signal for the omnidirectional actuation. This helps the acquisition of sensitive long part of the coda wave (CW) signals from multiple directions, which is hypothesized to enhance sensitivity through improved signal analysis. In this article, the design methodology and implementation of unique tone burst interdigitated electrodes (TB-IDT) are presented. Sensing using TB-IDT enables accessing multiple frequencies simultaneously. This results in a wider frequency spectrum and allows better scope for the detection of different target analytes. The novel design process utilized guided wave analysis of the substrate, and selective directional focused interdigitated electrodes (F-IDT) were implemented. The article demonstrates computational simulation along with experimental results with validation of multifrequency and multidirectional sensing capability. Full article
(This article belongs to the Special Issue MEMS Sensors and Applications)
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14 pages, 2459 KiB  
Article
Design of a High Sensitivity Pirani Gauge Based on Vanadium Oxide Film for High Vacuum Measurement
by Song Guo, Liuhaodong Feng, Shuo Chen, Yucheng Ji, Xinlin Peng, Yang Xu, Yong Yin and Shinan Wang
Sensors 2022, 22(23), 9275; https://doi.org/10.3390/s22239275 - 29 Nov 2022
Cited by 6 | Viewed by 1840
Abstract
We have designed a hot-plate-type micro-Pirani vacuum gauge with a simple structure and compatibility with conventional semiconductor fabrication processes. In the Pirani gauge, we used a vanadium oxide (VOx) membrane as the thermosensitive component, taking advantage of the high temperature coefficient of resistance [...] Read more.
We have designed a hot-plate-type micro-Pirani vacuum gauge with a simple structure and compatibility with conventional semiconductor fabrication processes. In the Pirani gauge, we used a vanadium oxide (VOx) membrane as the thermosensitive component, taking advantage of the high temperature coefficient of resistance (TCR) of VOx. The TCR value of VOx is 2%K13%K1, an order of magnitude higher than those of other thermal-sensitive materials, such as platinum and titanium (0.3%K10.4%K1). On one hand, we used the high TCR of VOx to increase the Pirani sensitivity. On the other hand, we optimized the floating structure to decrease the thermal conductivity so that the detecting range of the Pirani gauge was extended on the low-pressure end. We carried out simulation experiments on the thermal zone of the Pirani gauge, the width of the cantilever beam, the material and thickness of the supporting layer, the thickness of the thermal layer (VOx), the depth of the cavity, and the shape and size. Finally, we decided on the basic size of the Pirani gauge. The prepared Pirani gauge has a thermal sensitive area of 130 × 130 μm2, with a cantilever width of 13 μm, cavity depth of 5 μm, supporting layer thickness of 300 nm, and VOx layer thickness of 110 nm. It has a dynamic range of 10−1~104 Pa and a sensitivity of 1.23 V/lgPa. The VOx Pirani was designed using a structure and fabrication process compatible with a VOx-based uncooled infrared microbolometer so that it can be integrated by wafer level. This work contains only our MEMS Pirani gauge device design, preparation process design, and readout circuit design, while the characterization and relevant experimental results will be reported in the future. Full article
(This article belongs to the Special Issue MEMS Sensors and Applications)
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17 pages, 4840 KiB  
Article
Earthquake Event Recognition on Smartphones Based on Neural Network Models
by Meirong Chen, Chaoyong Peng and Zhenpeng Cheng
Sensors 2022, 22(22), 8769; https://doi.org/10.3390/s22228769 - 13 Nov 2022
Cited by 1 | Viewed by 2023
Abstract
Using sensors embedded in smartphones to study earthquake early warning (EEW) technology can effectively reduce the high construction and maintenance costs of traditional EEW systems. However, due to the impact of human activities, it is very difficult to accurately detect seismic events recorded [...] Read more.
Using sensors embedded in smartphones to study earthquake early warning (EEW) technology can effectively reduce the high construction and maintenance costs of traditional EEW systems. However, due to the impact of human activities, it is very difficult to accurately detect seismic events recorded on mobile phones. In this paper, to improve the detection accuracy of earthquakes on mobile phones, we investigated the suitability of different types of neural network models in seismic event detection. Firstly, we collected three-component acceleration records corresponding to human activities in various scenarios such as walking, running, and cycling through our self-developed mobile application. Combined with traditional strong-motion seismic event records fusing typical mobile phone accelerometer self-noise, all records were used for establishing the training and testing dataset. Finally, two types of neural network models, fully connected and convolutional neural networks, were trained, validated, and tested. The results showed that the accuracy rates of the neural network models were all over 98%, and the precision rate for seismic events and the recall rate for non-earthquake events could both reach 99%, indicating that the introduction of neural networks into the earthquake recognition on smartphones can significantly enhance the accuracy of seismic event recognition. Therefore, we can exceedingly reduce the amount of data transmitted to the processing server, further lowering the load on the server processor and effectively increasing the lead time at each target site for an EEW system. Full article
(This article belongs to the Special Issue MEMS Sensors and Applications)
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